XC7Z010-1CLG400C Manufacturers

XC7A35T-L2CSG325E is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

BCM65800IFBGH is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

XCZU9EG-1FFVC900I is a high-performance field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 600,000 logic cells, 34.6 Mb of block RAM, and 1,248 Digital Signal Processing (DSP) slices, making it ideal for high-performance applications. It operates on a 0.85V to 0.9V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The -1 speed grade of this FPGA allows it to operate up to 500 MHz in commercial temperature range and up to 400 MHz in industrial temperature range.

LTM4668IY#PBF is an electronic component, packaged in BGA-49 and produced by LINEAR/Lingte. The batch inventory information of this component shows that it is widely used in different electronic devices. Specifically, LTM4668IY # PBF belongs to µ Module ® The series

XC3S50AN-4TQG144I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

8-layer rigid-Flex PCB has the characteristics of bending and folding, so it can be used to make customized circuit, maximize the indoor available space, use this point, reduce the space occupied by the whole system, the overall cost of rigid Flex PCB will be relatively high, but with the continuous maturity and development of the industry, the overall cost will continue to reduce, so it will be more cost-effective and competitive power.