XC7VX485T-3FFG1158E Manufacturers

Being supported by an highly developed and specialist IT team, we could give technical support on pre-sales & after-sales service for XC7VX485T-3FFG1158E, Standing still today and seeking into the longer term, we sincerely welcome customers all over the environment to cooperate with us.
XC7VX485T-3FFG1158E, Adhering to the principle of "Enterprising and Truth-Seeking, Preciseness and Unity", with technology as the core, our company continues to innovate, dedicated to providing you with the highest cost-effective products and meticulous after-sales service. We firmly believe that: we are outstanding as we are specialized.

Hot Products

  • HI-35930PQTF

    HI-35930PQTF

    HI-35930PQTF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7Z045-3FFG676E

    XC7Z045-3FFG676E

    XC7Z045-3FFG676E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • copper paste filled hole PCB

    copper paste filled hole PCB

    copper paste filled hole PCB: Bai AE3030 copper pulp is a non-conductive DAO copper paste used for the high-density assembly of printed substrate DU plate and the laying of wires.Due to the characteristics of Zhuan "high Thermal conductivity", "bubble-free", "flat" and so on, the copper paste is most suitable for the design of high reliability Pad on Via, stack on Via and Thermal Via. The copper paste is widely used from aerospace satellite, server, cabling machine, LED backlight and so on.
  • XCZU15EG-3FFVB1156E

    XCZU15EG-3FFVB1156E

    ​XCZU15EG-3FFVB1156E is an FPGA (Field Programmable Gate Array) developed by Xilinx based on Zynq UltraScale+MPSoC architecture. It integrates high-performance computing cores and rich I/O interfaces, supports multiple high-speed data transmission and communication protocols, and is widely used in high-performance computing,
  • BCM43465C0KMMLW1G

    BCM43465C0KMMLW1G

    BCM43465C0KMMLW1G is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • TPS22975DSGR

    TPS22975DSGR

    TPS22975DSGR is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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