XC7VX485T-1FFG1761I Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • Nelco PCB

    Nelco PCB

    Nelco PCB is considered to be the best PCB material in PCB industry, so it is undoubtedly the best material choice. We have prepared sufficient inventory to meet your fast demand for Nelco PCB in small and medium volume. Models are N4000-13, N4000-13ep, N4000-13epsi, NY9220, NY9233, NY9300, N9300-13RF, etc
  • XCKU5P-1FFVB676E

    XCKU5P-1FFVB676E

    ​XCKU5P-1FFVB676E is an FPGA (Field Programmable Gate Array) produced by AMD/Xilinx, belonging to Kintex ® UltraScale+FPGA series. This FPGA has multiple power options to achieve the best balance between required system performance and extremely low power consumption. It offers excellent cost-effectiveness, performance,
  • XCKU040-1FFVA1156C

    XCKU040-1FFVA1156C

    ​XCKU040-1FFVA1156C is a high-performance, low-power FPGA (Field Programmable Gate Array) chip that demonstrates strong application potential and is widely used in various fields such as industrial automation, smart homes, medical equipment, and transportation. With its high performance, low power consumption, and programmability, this chip plays an irreplaceable role in multiple fields.
  • XCZU1CG-L1UBVA494I

    XCZU1CG-L1UBVA494I

    XCZU1CG-L1UBVA494I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM49408A0KFEBG

    BCM49408A0KFEBG

    BCM49408A0KFEBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU7P-L2FLVB2104E

    XCVU7P-L2FLVB2104E

    XCVU7P-L2FLVB2104E The device provides the highest performance and integrated functionality on the 14nm/16nm FinFET node. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements

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