XC7S75-1FGGA676C Manufacturers

Traditionally, for reliability reasons, passive components have tended to be used on the backplane. However, in order to maintain the fixed cost of the active board, more and more active devices such as BGA are designed on the backplane.The following is about Red High speed Backplane. related, I hope to help you better understand Red High speed Backplane.

BCM54616C0KFBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

​5CSEBA4U23I7N is a SoC FPGA (Field Programmable Gate Array) produced by Altera, which has high performance and rich functional features. Here is a detailed introduction about 5CSEBA4U23I7N:

​Xilinx XCKU15P-2FFVA1156E Kintex® UltraScale ™ Field programmable gate arrays can achieve extremely high signal processing bandwidth in mid-range devices and next-generation transceivers. FPGA is a semiconductor device based on a configurable logic block (CLB) matrix connected through a programmable interconnect system

XCVU9P-2FLGA2577I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

XC7K160T-3FFG676E is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.