XC7S50-2FGGA484C Manufacturers

We've got a specialist, effectiveness staff to supply high quality service for our shopper. We always follow the tenet of customer-oriented, details-focused for XC7S50-2FGGA484C, We are generally looking ahead to forming effective business associations with new clientele around the world.
XC7S50-2FGGA484C, During in 11 years, We now have participated in more than 20 exhibitions, obtains the highest praise from each customer. Our company has been devoting that "customer first" and committed to helping customers expand their business, so that they become the Big Boss !

Hot Products

  • Ro4003C PCB

    Ro4003C PCB

    Ro4003c PCB is made of Rogers 4000 series high frequency materials. It has good dielectric properties and very small loss. It should be widely used in microwave, high frequency and RF fields.
  • BCM56867A1IFSBG

    BCM56867A1IFSBG

    BCM56867A1IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7VX550T-2FFG1158I

    XC7VX550T-2FFG1158I

    Model: XC7VX550T-2FFG1158I Packaging: FCBGA-1158 Product type: Embedded FPGA (Field Programmable Gate Array)
  • EP4CGX30CF23C7N

    EP4CGX30CF23C7N

    ​EP4CGX30CF23C7N is a Cyclone IV GX series FPGA chip produced by Intel (formerly Altera). The chip has 1840 LAB/CLBs, 29440 logic elements/units, and 290 I/O ports, supporting high-speed data processing and flexible logic configuration. It is packaged in 484-FBGA,
  • XC7A50T-L2CSG325E

    XC7A50T-L2CSG325E

    XC7A50T-L2CSG325E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU7P-3FLVC2104E

    XCVU7P-3FLVC2104E

    ​XCVU7P-3FLVC2104E also supports humidity sensitivity and adapts to different working environment requirements. The packaging form of this chip is BGA, which provides powerful logic processing capability and high-speed data transmission rate,

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