XC7S50-1FTGB196I Manufacturers

With our exceptional administration, robust technical capability and strict high-quality control procedure, we carry on to provide our consumers with dependable high-quality, reasonable selling prices and superb providers. We aim at becoming amongst your most responsible partners and earning your pleasure for XC7S50-1FTGB196I, We sincerely welcome mates to negotiate organization and start cooperation. We hope to affix hands with good friends in different industries to produce a fantastic long term.
XC7S50-1FTGB196I, We pay high attention to customer service, and cherish every customer. We now have maintained a strong reputation in the industry for many years. We've been honest and work on building a long-term relationship with our customers.

Hot Products

  • AP9111R Rigid-Flex PCB

    AP9111R Rigid-Flex PCB

    The AP9111R Rigid-Flex PCB combines the advantages of the rigid characteristics of the rigid circuit board and the bendable characteristics of the flexible board, so that the PCB is no longer a two-dimensional plane layer of oil, but is folded by a three-dimensional internal connection and arbitrary bending. The following is about 12 Layer 8R4F Rigid Flex Board related, I hope to help you better understand 12 Layer AP9111R Rigid-Flex PCB.
  • BCM56960B1KFSBG

    BCM56960B1KFSBG

    BCM56960B1KFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S400-4FTG256C

    XC3S400-4FTG256C

    XC3S400-4FTG256C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Large size HDI PCB

    Large size HDI PCB

    The buried hole is not necessarily HDI. Large size HDI PCB first-order and second-order and third-order how to distinguish the first-order is relatively simple, the process and process are easy to control. Second order began to trouble, one is the problem of alignment, a hole and copper plating problem.
  • XCVU57P-2FSVK2892E

    XCVU57P-2FSVK2892E

    XCVU57P-2FSVK2892E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7A50T-2CSG325I

    XC7A50T-2CSG325I

    XC7A50T-2CSG325I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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