Products
Home > Products > XC7K70T-3FBG676E

XC7K70T-3FBG676E Manufacturers

We depend on sturdy technical force and continually create sophisticated technologies to meet the demand of XC7K70T-3FBG676E, Therefore, we could satisfy different inquiries from different clients. Remember to come across our web site to check additional facts from our items.
XC7K70T-3FBG676E, We are sticking to excellent quality, competitive price and punctual delivery and better service, and sincerely hope to establish long-term good relationships and cooperation with our new and old business partners from all over the world. Sincerely welcome you to join us.

Related Products

Hot Products

  • BCM65551B1IFSBG

    BCM65551B1IFSBG

    BCM65551B1IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EPM2210F324C5N

    EPM2210F324C5N

    EPM2210F324C5N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EPF6016ATC144-3N

    EPF6016ATC144-3N

    EPF6016ATC144-3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Half-hole HDI PCB

    Half-hole HDI PCB

    Half-hole HDI PCB is a compact product designed for small capacity users. It adopts modular parallel design, with a module capacity of 1000VA (height of 1U), natural cooling, and can be directly put into a 19 "rack, with a maximum of 6 modules in parallel. The product adopts full digital signal processing (DSP) technology and a number of patent technologies. It has a full range of load adaptability and strong short-term overload capacity, and can not consider the load power factor and peak factor.
  • Alumina Ceramic PCB for auto lamp

    Alumina Ceramic PCB for auto lamp

    The alumina ceramic substrate series can effectively reduce the junction temperature of the headlight LED of the car, thereby greatly increasing the service life and luminous efficiency of the LED, and is especially suitable for use in a sealed environment with high stability requirements, a more demanding ambient temperature.The following is about Alumina Ceramic PCB for auto lamp, I hope to help you better understand Alumina Ceramic PCB for auto lamp.
  • BCM89830A0BWMLG

    BCM89830A0BWMLG

    BCM89830A0BWMLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Related Blog
  • Reviews

  • Definition of PCB

    PCB (printed circuit board) is a printed circuit board, which is one of the important components of the electronics industry.

  • PCB multilayer board

    PCB multilayer board refers to the multilayer circuit board used in electrical products

  • Introduction of chip

    Chip, also known as microcircuit, microchip, integrated circuit (IC). It refers to the silicon chip containing integrated circuits, which is very small and often part of computers or other electronic equipment.

  • Precautions for processing covering film of FPC circuit board

    The covering film of FPC circuit board shall be processed by opening the window, but it cannot be processed immediately after being taken out from the cold storage. Especially when the ambient temperature is high and the temperature difference is large, water droplets will condense on the surface.

  • What should be paid attention to in PCB proofing?

    PCB proofing, also known as PCB proofing, is an important electronic component. It is the main support of electronic components and the provider of electronic component connection

  • Some Important Properties of Semiconductors

    Why does the resistivity of semiconductor go down with temperature？Between the conductor and semiconductor resistivity difference is due to the different density of charge carriers.

Send Inquiry