XC7K410T-2FBG676C Manufacturers

"Quality 1st, Honesty as base, Sincere company and mutual profit" is our idea, in an effort to create consistently and pursue the excellence for XC7K410T-2FBG676C, We normally welcome new and outdated customers presents us with worthwhile advice and proposals for cooperation, allow us to develop and acquire jointly, also to contribute to our local community and staff!
XC7K410T-2FBG676C, With the goal of "zero defect". To care for the environment, and social returns, care employee social responsibility as own duty. We welcome friends from all over the world to visit and guide us so that we can achieve the win-win goal together.

Hot Products

  • XC7K325T-1FBG900C

    XC7K325T-1FBG900C

    XC7K325T-1FBG900C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM65800IFBGH

    BCM65800IFBGH

    BCM65800IFBGH is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7VX485T-2FFG1927I

    XC7VX485T-2FFG1927I

    XC7VX485T-2FFG1927I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 5CEFA4F23C6N

    5CEFA4F23C6N

    5CEFA4F23C6N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC2S100E-6PQG208C

    XC2S100E-6PQG208C

    XC2S100E-6PQG208C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Mixed HDI PCB of RO4003C

    Mixed HDI PCB of RO4003C

    High-frequency substrates, satellite systems, mobile phone receiving base stations and other communication products must use high-frequency circuit boards, which will inevitably develop rapidly in the next few years, and high-frequency substrates will be in large demand. The following is about Mixed HDI PCB of RO4003C related, I hope to help you better understand Mixed HDI PCB of RO4003C.

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