Products
Home > Products > XC7K160T-L2FFG676I

XC7K160T-L2FFG676I Manufacturers

We have now our possess revenue group, design staff, technical crew, QC team and package group. We now have strict excellent regulate procedures for each process. Also, all of our workers are experienced in printing subject for XC7K160T-L2FFG676I, we could solve our customer problems asap and do the profit for our customer. For those who need superior provider and excellent , pls choose us , thanks !
XC7K160T-L2FFG676I, With nearly 30 years' experience in business, we have been confident in superior service, quality and delivery. We warmly welcome customers from all over the world to cooperate with our company for common development.

Related Products

Hot Products

  • 5AGTFD7K3F40I3N

    5AGTFD7K3F40I3N

    5AGTFD7K3F40I3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • CY7C2665KV18-450BZI

    CY7C2665KV18-450BZI

    CY7C2665KV18-450BZI integrated circuit, is the memory chip of CYPRESS, storage capacity: 144Mbit, power: 450MHZ, package: 165-FBGA
  • XC7A50T-2CSG325C

    XC7A50T-2CSG325C

    XC7A50T-2CSG325C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM67263B0KFFBG

    BCM67263B0KFFBG

    BCM67263B0KFFBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S1400A-5FGG484C

    XC3S1400A-5FGG484C

    XC3S1400A-5FGG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC2S300E-6FGG456C

    XC2S300E-6FGG456C

    XC2S300E-6FGG456C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Related Blog
  • Reviews

  • How to design a PCB for high frequency?

    Designing a PCB (Printed Circuit Board) for high-frequency applications requires careful consideration of various factors to ensure signal integrity, minimize losses, and mitigate electromagnetic interference. Here are some key steps and considerations:

  • What the hell is a chip

    Chips are large-scale, microelectronic integrated circuits. That is, the printed circuit board is scaled down to nanometer (one millionth of a millimeter). On the front of the traditional printed circuit board, there are a large number of radio components, including triodes, diodes, capacitors, electrolysers, resistors, mid cycle regulators, switches, power amplifiers, detectors, filters, and so on.

  • Analysis of PCB Factory Automation and Industry 4.0 Planning

    The main purpose of PCB factory automation and smart factory design investment is to save labor costs, improve product yield, reduce operation intensity and effectively arrange production in order to achieve effective coordination of various processes and optimal operation of the factory.

  • Causes and solutions of blistering in multilayer circuit boards

    Reasons for blistering of multilayer circuit board

  • Installation mode of components on PCB printed circuit board

    Our common computer boards and cards are basically epoxy resin glass cloth based double-sided printed circuit boards. One side is the plug-in components, and the other side is the welding surface of the component feet. It can be seen that the welding points are very regular

  • Advantages and disadvantages of Flex-Rigid PCB

    The flexible circuit board is rolled with copper and similar materials, and the main goal is to provide sufficient flexibility and bending resistance. On the other hand, flexible rigid PCBs are constructed using a combination of two technologies and have flexible and rigid areas.

Send Inquiry