XC7K160T-3FFG676E Manufacturers

10M08SAU169I7G is an FPGA (Field Programmable Gate Array) product produced by Intel (formerly Altera). Here are some detailed information about 10M08SAU169I7G

​XC7Z045-1FFG900I is a Zynq-7000 series System on a Chip (SoC) product produced by Xilinx. This chip has the following characteristics and specifications:

24 Layers ELIC HDI PCB--When a printed circuit board is made into a final product, integrated circuits, transistors (triodes, diodes), passive components (such as resistors, capacitors, connectors, etc.) and various other electronic parts are mounted on it. The following is about 24 Layers of Any Connected HDI related, I hope to help you better understand 24 Layers of Any Connected HDI.

​10M50DAF256C7G is an FPGA (Field Programmable Gate Array) product produced by Altera Corporation. This FPGA is non-volatile, has 178 I/O ports, and is packaged in 256FBGA. It uses 14 nanometer three gate (FinFET) process technology, supports SmartVID control core voltage, and provides standard power devices

​The design of 5CEBA2F23C8N can simultaneously meet the decreasing power consumption, cost, and time to market requirements, as well as the increasing bandwidth demands of high-capacity and cost sensitive applications. Due to the integration of transceivers and hard memory controllers

EP3SE50F780I3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.