XC7A75T-2FGG484C Manufacturers

​5CEBA9F23C7N is a Cyclone V series FPGA chip produced by Intel (formerly Altera). This chip has high performance and flexibility, suitable for various complex design requirements. Its main features include:

N9000-13rf PCB is a RF substrate developed by nelco company in Singapore. It is FR4 and easy to process. Its application field is usually communication industry

XCVU440-2FLGA2892E is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

Ro3003 Material is a high frequency circuit material filled with PTFE composite material, which is used in commercial microwave and RF applications. The product series aims to provide excellent electrical and mechanical stability at competitive prices. Rogers ro3003 has excellent dielectric constant stability over the entire temperature range, including eliminating the change of dielectric constant when using PTFE glass at room temperature. In addition, the loss coefficient of the ro3003 laminate is as low as 0.0013 to 10 GHz.

GA100-875GG1-A1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

XC3S1400A-4FTG256I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.