Products
Home > Products > XC7A50T-2CSG324I

XC7A50T-2CSG324I Manufacturers

"Control the quality by the details, show the strength by quality". Our company has strived to establish a highly efficient and stable staff team and explored an effective quality control process for XC7A50T-2CSG324I, Welcome any inquiry to our firm. We will be happy to ascertain helpful business enterprise relationships along with you!
XC7A50T-2CSG324I, As an experienced manufacturer we also accept customized order and we could make it the same as your picture or sample specification. The main goal of our company is to live a satisfactory memory to all the customers, and establish a long term business relationship with buyers and users all over the world.

Related Products

Hot Products

  • XC7S75-2FGGA484C

    XC7S75-2FGGA484C

    XC7S75-2FGGA484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10AX048E4F29E3SG

    10AX048E4F29E3SG

    ​The 10AX048E4F29E3SG chip is a field programmable gate array (FPGA) chip launched by Intel/Altera, belonging to the Arria 10 GX series. It has 480000 logic units and a 20 nanometer process, and operates at a voltage of 0.9 volts. This chip is suitable for applications that require high performance and low power consumption, such as medical devices
  • BCM43794B0IFFBG

    BCM43794B0IFFBG

    BCM43794B0IFFBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP2C8F256C8N

    EP2C8F256C8N

    EP2C8F256C8N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • AD102-875-A1

    AD102-875-A1

    AD102-875-A1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7V585T-2FFG1761I

    XC7V585T-2FFG1761I

    ​XC7V585T-2FFG1761I has been optimized for the highest system performance and capacity, resulting in a 2x increase in system performance. The highest performance device using stacked silicon interconnect (SSI) technology.
  • Related Blog
  • Reviews

  • electronic component. pcb

    Printed circuit board (PCB), also known as printed circuit board, is the supplier of electrical connection of electronic components. Its development has a history of more than 100 years. Its design is mainly layout design. The main advantage of using circuit board is that it greatly reduces the wiring and assembly errors, and improves the automation level and production labor rate. According to the number of circuit board layers, it can be divided into single board, double board, four board, six board and other multilayer circuit boards.

  • Do you really know about FPCs

    of FPC is becoming more and more significant in order to achieve more functions. Now Jin Baize will talk about the characteristics of FPC on the advantages and disadvantages of FPC.

  • Definition and cause of pink circle on circuit board PCB

    After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.

  • Advantages of HDI PCB

    1. It can reduce the cost of HDI PCB: When the density of PCB increases to more than eight-layer board, it is manufactured with HDI, and its cost will be lower than that of the traditional complex pressing process.

  • The characteristics of rigid-flex board

    Rigid-flex board is a combination of flexible board and hard board. It is a circuit board formed by combining a thin layered flexible bottom layer with a rigid bottom layer, and then laminating it into a single component.The flexible board is used to replace the cable assembly to complete the highly reliable connection and transmission of power and electrical signals.The product can work stably and reliably for a long time under harsh environments such as high and low temperature, high humidity, vibration, salt spray, and low air pressure. At present, Jonhon Optronic has provided rigid and flexible printed board solutions for aviation, aerospace, ships, weapons and other fields.

  • How to design the lamination when designing a 4-layer PCB circuit board

    When designing a four layer PCB circuit board, how to design the stack? Theoretically, there can be three schemes

Send Inquiry