XC7A35T-1FTG256C Manufacturers

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Hot Products

  • XCKU060-1FFVA1156I

    XCKU060-1FFVA1156I

    XCKU060-1FFVA1156I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU19P-2FSVA3824E

    XCVU19P-2FSVA3824E

    Part status: Active LAB/CLB number: 510720 Logic components/units number: 8937600 Total RAM bits: 79586918I/O number: 1976 Number of gates: - Voltage - XCVU19P-2FSVA3824E Power supply: 0.825V~0.876V Installation type: Surface mount type Working temperature: 0 ° C~100 ° C (TJ) Product packaging: 3824-BBGA, FCBGA
  • HI-8588PST

    HI-8588PST

    ​HI-8588PST is an ARINC 429 bus interface receiver with an SO 8-pin package, utilizing analog/digital CMOS technology.
  • BCM56265B0KFSBG

    BCM56265B0KFSBG

    The BCM56265B0KFSBG is a high-performance networking chip designed and manufactured by Broadcom Limited. Belonging to the esteemed StrataXGS family of switches, this chip offers a robust solution for a wide range of networking applications, including but not limited to enterprise networks, data centers, and service provider environments.
  • XC7Z035-2FFG900I

    XC7Z035-2FFG900I

    ​XC7Z035-2FFG900I ARM® Cortex ™- The A9 processor is available in dual core (Zynq-7000) and single core (Zynq-7000S) Cortex-A9 configurations, providing integrated 28nm programmable logic per watt, with power consumption and performance levels surpassing discrete processors and FPGA systems
  • Multilayer PCB circuit board

    Multilayer PCB circuit board

    Multilayer PCB circuit board--The manufacturing method of multilayer board is generally made by the inner layer pattern first, and then the single or double-sided substrate is made by printing and etching method, which is included in the designated interlayer, and then heated, pressurized and bonded. As for the subsequent drilling, it is the same as the plating through-hole method of double-sided plate. It was invented in 1961.

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