XC7A200T-2SBG484I Manufacturers

Our organization puts emphasis to the administration, the introduction of talented personnel, and also the construction of team building, making an attempt hard to enhance the standard and liability consciousness of workers members. Our business successfully attained IS9001 Certification and European CE Certification of XC7A200T-2SBG484I, Initial enterprise, we understand each other. Additional enterprise, the trust is getting there. Our firm usually at your service anytime.
XC7A200T-2SBG484I, Our organization. Situated inside the national civilized cities, the visitors is very easy, unique geographical and economic situations. We pursue a "people-oriented, meticulous manufacturing, brainstorm, construct brilliant" organization. hilosophy. Strict top quality management, fantastic service, reasonable cost in Myanmar is our stand on the premise of competition. If vital, welcome to make contact with us by our web page or telephone consultation, we're likely to be happy to serve you.

Hot Products

  • AP7164E Rigid-Flex PCB

    AP7164E Rigid-Flex PCB

    8-Layers AP7164E Rigid-Flex PCB is mainly used in various products such as mobile phones, digital cameras, tablets, notebook computers, wearable devices and so on. The application of FPC flexible circuit boards in smart phones accounts for a large proportion. Our company can skillfully produce multi-layer fpc, soft-hard combination fpc, multi-layer HDI soft-hard combination board. It has stable cooperation with HP, Dell, Sony, etc.
  • XCVU095-2FFVC2104E

    XCVU095-2FFVC2104E

    ​The XCVU095-2FFVC2104E device provides optimal performance and integration at 20nm, including serial I/O bandwidth and logic capacity. As the only high-end FPGA in the 20nm process node industry, this series is suitable for applications ranging from 400G networks to large-scale ASIC prototype design/simulation.
  • XCVU5P-2FLVA2104I

    XCVU5P-2FLVA2104I

    ​The XCVU5P-2FLVA2104I Virtex UltraScale+device is a high-performance FPGA based on 14nm/16nm FinFET nodes, supporting 3D IC technology and various computationally intensive applications.
  • EP4SGX230FF35C4G

    EP4SGX230FF35C4G

    EP4SGX230FF35C4G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Megtron6 step PCB

    Megtron6 step PCB

    In addition to the requirement for uniform thickness of the plating layer for drilling, backplane designers generally have different requirements for the uniformity of copper on the surface of the outer layer. Some designs etch few signal lines on the outer layer. The following is about Megtron6 step PCB related, I hope to help you better understand Megtron6 step PCB.
  • XC5VFX100T-1FF1738C

    XC5VFX100T-1FF1738C

    ​XC5VFX100T-1FF1738C is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, belonging to the Virtex-5 FXT series. This chip has the following key features:

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