XC7A200T-2FFG1156I Manufacturers

That has a positive and progressive attitude to customer's fascination, our enterprise constantly improves our merchandise high quality to meet the demands of customers and further focuses on safety, reliability, environmental requirements, and innovation of XC7A200T-2FFG1156I, Through our hard work, we have always been on the forefront of clean technology product innovation. We are a green partner you can rely on. Contact us today for more information!
XC7A200T-2FFG1156I, In order to meet more market demands and long-term development, a 150, 000-square-meter new factory is under construction, which will be put into use in 2014. Then, we shall own a large capacity of producing. Of course, we are going to continue improving the service system to meet the requirements of customers, bringing health, happiness and beauty to everyone.

Hot Products

XC6SLX9-2FTG256C
XC6SLX9-2FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
Ceramic PCB
Ceramic PCB substrate is a 96% aluminum oxide ceramic double-sided copper clad substrate, which is mainly used in high-power module power supplies, high-power LED lighting substrates, solar photovoltaic substrates, high-power microwave power devices, which have high thermal conductivity, high pressure resistance, high temperature resistance, solderability resistance.
AP8555R Rigid-Flex PCB
The application scope of AP8555R Rigid-Flex PCB mainly includes: aerospace, such as high-end aircraft mounted weapon navigation system, advanced medical equipment, digital camera, portable camera and high-quality MP3 player.
XC7A200T-1FFG1156I
XC7A200T-1FFG1156I is a high-performance, low-power FPGA chip produced by Xilinx. Here is a detailed introduction of the chip: Basic characteristics: Adopting a 28 nanometer process, it has the characteristics of high performance and low power consumption.
XCZU15EG-1FFVB1156I
XCZU15EG-1FFVB1156I Zynq™ UltraScale+ ™ MPSoC devices not only provide scalability for 64 bit processors, but also combine real-time control with software and hardware engines, supporting graphics, video, waveform, and packet processing
XC7A200T-1SBG484C
XC7A200T-1SBG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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5G base stations require high-frequency and high-speed circuits, PCB has become a popular product line in the 5G era
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Precautions for processing covering film of FPC circuit board
The covering film of FPC circuit board shall be processed by opening the window, but it cannot be processed immediately after being taken out from the cold storage. Especially when the ambient temperature is high and the temperature difference is large, water droplets will condense on the surface.

XC7A200T-2FFG1156I Manufacturers

Related Products

Hot Products

XC6SLX9-2FTG256C

Ceramic PCB

AP8555R Rigid-Flex PCB

XC7A200T-1FFG1156I

XCZU15EG-1FFVB1156I

XC7A200T-1SBG484C

Analysis of PCB Factory Automation and Industry 4.0 Planning

Features of PCB

Hongtai tells you why the more developed countries, the less support mobile payment?

How to design a PCB for high frequency?

5G base stations require high-frequency and high-speed circuits, PCB has become a popular product line in the 5G era

Precautions for processing covering film of FPC circuit board

Cora 2024-05-08 01:17:14

Ricardo 2023-11-18 03:24:51

Amy 2021-08-16 21:01:32

Edith 2023-03-16 08:26:00

Debby 2022-09-15 02:14:12

Nicola 2024-02-07 05:04:02

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An Integrated Circuit (IC) functions by integrating various electronic components onto a semiconductor material, typically silicon.

After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.