XC7A200T-2FBG676I Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • BCM56846A1KFTBLG

    BCM56846A1KFTBLG

    BCM56846A1KFTBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 4.25g Optical Module PCB

    4.25g Optical Module PCB

    The main reason for using SFF on the ONU side is that the ONU products of the EPON system are usually placed on the user side and require fixed, not hot-swappable. With the rapid development of PON technology, SFF is gradually replaced by BOB.The following is about 4.25g Optical Module PCB related, I hope to help you better understand 4.25g Optical Module PCB.
  • N9000-13RF PCB

    N9000-13RF PCB

    N9000-13rf PCB is a RF substrate developed by nelco company in Singapore. It is FR4 and easy to process. Its application field is usually communication industry
  • BCM65040IMLGT

    BCM65040IMLGT

    BCM65040IMLGT is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • ELIC Rigid-Flex PCB

    ELIC Rigid-Flex PCB

    ELIC Rigid-Flex PCB is the interconnection hole technology in any layer. This technology is the patent process of Matsushita Electric Component in Japan. It is made of short fiber paper of DuPont's "poly aramid" product thermount, which is impregnated with high-function epoxy resin and film. Then it is made of laser hole forming and copper paste, and copper sheet and wire are pressed on both sides to form a conductive and interconnected double-sided plate. Because there is no electroplated copper layer in this technology, the conductor is only made of copper foil, and the thickness of the conductor is the same, which is conducive to the formation of finer wires.
  • XCVU19P-1FSVB3824E

    XCVU19P-1FSVB3824E

    ​XCVU19P-1FSVB3824E is an FPGA (Field Programmable Gate Array) produced by Xilinx, belonging to the Virtex UltraScale+series. This FPGA has the following key features:

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