XC6VLX550T-1FFG1760I Manufacturers

We believe in: Innovation is our soul and spirit. Quality is our life. Shopper need is our God for XC6VLX550T-1FFG1760I, To acquire a consistent, profitable, and constant development by getting a aggressive advantage, and by continuously increasing the value added to our shareholders and our employee.
XC6VLX550T-1FFG1760I, Wide selection and fast delivery to suit your needs! Our philosophy: Good quality, great service, keep improving. We are looking forward that more and more oversea friends join in our family for further development near the future!

Hot Products

  • XCKU040-2FFVA1156E

    XCKU040-2FFVA1156E

    XCKU040-2FFVA1156E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • AD250 PCB

    AD250 PCB

    High-frequency mixed-press material step board manufacturing technology is a circuit board manufacturing technology that has emerged with the rapid development of the communications and telecommunications industries. It is mainly used to break through the high-speed data and high information content that traditional printed circuit boards cannot reach. The bottleneck of transmission. The following is about AD250 PCB related, I hope to help you better understand AD250 PCB.
  • EP4S40GH40I2G

    EP4S40GH40I2G

    EP4S40GH40I2G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7K410T-2FBG676I

    XC7K410T-2FBG676I

    XC7K410T-2FBG676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S400A-4FTG256C

    XC3S400A-4FTG256C

    The XC3S400A-4FTG256C chip adopts Xilinx's Virtex-3 series FPGA, which is known for its high-performance logic units and memory resources, and can achieve high-speed digital signal processing and data processing. This chip supports various applications such as digital signal processing, communication, and digital control, with rich digital interfaces and I/O interfaces, making it easy to connect with other digital and analog devices
  • XC6SLX100T-2FGG484I

    XC6SLX100T-2FGG484I

    XC6SLX100T-2FGG484I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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