XC6VLX365T-2FFG1759C Manufacturers

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Hot Products

  • XC5VLX85-1FFG676C

    XC5VLX85-1FFG676C

    XC5VLX85-1FFG676C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU095-1FFVB2104I

    XCVU095-1FFVB2104I

    ​XCVU095-1FFVB2104I is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, belonging to the Kintex UltraScale series. This chip adopts advanced 20nm process technology, providing maximum performance and integration, especially suitable for applications in high-performance computing, network communication, data centers, and AI fields. Here are some detailed introductions about XCVU095-1FFVB2104I
  • XCVU11P-2FLGB2104E

    XCVU11P-2FLGB2104E

    ​XCVU11P-2FLGB2104E is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, belonging to the Virtex UltraScale series. This chip adopts advanced 20nm process technology, providing excellent performance and integration, especially suitable for high-performance computing, network communication, video processing and other application fields. The main features of XCVU11P-2FLGB2104E chip include:
  • 10M25DAF484C8G

    10M25DAF484C8G

    ​10M25DAF484C8G is an FPGA (Field Programmable Gate Array) product produced by Altera (now acquired by Intel). This FPGA adopts FBGA484 package and has the following key features: Packaging form: FBGA484 packaging is used, which is a surface mount technology suitable for high-density integrated circuits. Working temperature range: The minimum working temperature is -40 ° C, and the maximum working temperature is 130 ° C, suitable for applications under various environmental conditions.
  • XC7VX690T-3FFG1926E

    XC7VX690T-3FFG1926E

    XC7VX690T-3FFG1926E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Heavy copper PCB

    Heavy copper PCB

    Printed circuit boards are usually bonded with a layer of copper foil on glass epoxy substrate. The thickness of copper foil is usually 18 μ m, 35 μ m, 55 μ m and 70 μ M. The most commonly used copper foil thickness is 35 μ M. When the weight of copper is more than 70UM, it is called heavy copper PCB

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