XC6VLX130T-2FFG784I Manufacturers

We've got a highly efficient group to deal with inquiries from shoppers. Our purpose is "100% client fulfillment by our product high-quality, price tag & our staff service" and enjoy a superb reputation amongst clientele. With quite a few factories, we will provide a wide variety of XC6VLX130T-2FFG784I, Initial enterprise, we understand each other. Additional enterprise, the trust is getting there. Our firm usually at your service anytime.
XC6VLX130T-2FFG784I, As an experienced manufacturer we also accept customized order and we could make it the same as your picture or sample specification. The main goal of our company is to live a satisfactory memory to all the customers, and establish a long term business relationship with buyers and users all over the world.

Hot Products

  • TG250 PCB

    TG250 PCB

    Tg250 PCB is made of polyimide material. It can withstand high temperature for a long time and does not deform at 230 degrees. It is suitable for high temperature equipment, and its price is slightly higher than that of ordinary FR4
  • BCM84074AIFSBLG

    BCM84074AIFSBLG

    BCM84074AIFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU9P-2FLGA2104E

    XCVU9P-2FLGA2104E

    XCVU9P-2FLGA2104E is a high-end field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 2.5 million logic cells, 29.5 Mb of block RAM, and 3240 Digital Signal Processing (DSP) slices, making it ideal for high-performance applications such as high-speed networking, wireless communication, and video processing. It operates on a 0.85V to 0.9V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCI Express. The device has a maximum operating frequency of up to 1.2 GHz. The device comes in a flip-chip BGA (FLGA2104E) package with 2104 pins, providing high pin-count connectivity for a variety of applications. XCVU9P-2FLGA2104E is commonly used in advanced systems such as data center acceleration, machine learning, and high-performance computing. The device is known for its high processing capacity, low power consumption, and high-speed performance, making it a top choice for mission-critical applications where reliability and performance are critical.
  • 5SGXMABK2H40I3LN

    5SGXMABK2H40I3LN

    5SGXMABK2H40I3LN is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7VX690T-3FFG1761I

    XC7VX690T-3FFG1761I

    XC7VX690T-3FFG1761I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7VX690T-3FFG1927C

    XC7VX690T-3FFG1927C

    XC7VX690T-3FFG1927C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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