XC6SLX9-3CPG196I Manufacturers

We rely upon strategic thinking, constant modernisation in all segments, technological advances and of course upon our employees that directly participate in our success for XC6SLX9-3CPG196I, Our aim is "blazing new ground, Passing Value", in the future, we sincerely invite you to grow up with us and make a bright future together!
XC6SLX9-3CPG196I, In order to meet more market demands and long-term development, a 150, 000-square-meter new factory is under construction, which might be put into use in 2014. Then, we shall own a large capacity of producing. Of course, we will continue improving the service system to meet the requirements of customers, bringing health, happiness and beauty to everyone.

Hot Products

  • XC6SLX4-3CSG225C

    XC6SLX4-3CSG225C

    XC6SLX4-3CSG225C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • AIN PCB

    AIN PCB

    AIN PCB have excellent properties such as high thermal conductivity, high strength, high resistivity, small density, low dielectric constant, non-toxicity, and thermal expansion coefficient matching with Si. AIN PCB will gradually replace traditional high-power LED base material and become A ceramic substrate material with the most future development. The most suitable heat dissipation substrate for AIN PCB
  • EP4CE15F23I8LN

    EP4CE15F23I8LN

    EP4CE15F23I8LN is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 10M02SCE144C8G

    10M02SCE144C8G

    10M02SCE144C8G is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM68461A1KRFBG

    BCM68461A1KRFBG

    BCM68461A1KRFBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7A100T-1FTG256I

    XC7A100T-1FTG256I

    XC7A100T-1FTG256I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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