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The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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    XC3S50AN-4TQG144I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Car Collision Avoidance Radar PCB

    Car Collision Avoidance Radar PCB

    The frequency of vehicle millimeter wave radar is mainly divided into 24GHz frequency band and 77GHz frequency band, of which 77GHz frequency band represents the future trend. The reliability of 77G radar board is very important. It is related to the safety of car driving. Among them, the reliability of electroplating is the most important factor affecting its reliability. The following is about Car Collision Avoidance Radar PCB related, I hope to help you better understand Car Collision Avoidance Radar PCB.
  • EP3C55F780I7N

    EP3C55F780I7N

    EP3C55F780I7N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • AD7228ACRZ

    AD7228ACRZ

    AD7228ACRZ Digital-to-Analog Converter (DAC) ADI/Analog DAC-DAC OCTAL 8-BIT 5-15V DAC IC
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    XC6SLX25-L1CSG324I

    XC6SLX25-L1CSG324I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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    5SGXMA3H3F35C4G

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  • PCB production, you must pay attention to these matters

    Cutting, fillet, edging, baking, inner layer pretreatment, coating, exposure, DES (development, etching, film removal), punching, AOI inspection, VRS repair, browning, lamination, pressing, target drilling, Gong edge, drilling, copper plating, film pressing, printing, writing, surface treatment, final inspection, packaging and other processes are countless

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    Recently, the semiconductor industry has received much attention. Morgan Stanley recently released a report stating that the deflation of the technology industry, coupled with long-term demand for artificial intelligence semiconductors, will trigger the next industry upward cycle for logic semiconductors. This news has inspired the semiconductor industry, and some people believe that the spring of semiconductors is not far away. So, let's analyze the current situation and future of the semiconductor industry.

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    PCB (printed circuit board) is a printed circuit board, which is one of the important components of the electronics industry.

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    The advantages of heavy copper PCB make it the top priority for the development of high-power circuits. The heavy copper concentration can handle high power and high heat, which is why high-power circuits have been developed using this technology. Such circuits cannot be developed with low-copper concentration PCBs because they cannot withstand the huge thermal stresses caused by high currents and flowing currents.

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    High Density Interconnection (HDI) PCB is a kind of (technology) for the production of printed circuit boards. It is a circuit board with relatively high circuit distribution density using micro blind via and buried via technology.

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