XC6SLX45T-2CSG484C Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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XCKU040-2FBVA676E
XCKU040-2FBVA676E is a Kintex based ® The UltraScale architecture FPGA (Field Programmable Gate Array) chip is produced by AMD (formerly Xilinx). It has high performance and flexible programmability, suitable for a wide range of application fields such as data centers
XC6SLX25-3FT256I
XC6SLX25-3FT256I Category: Integrated Circuits, Description: Embedded-Fpga (Field Programmable Gate Array) Integrated Circuits (ics); Ic Fpga Spartan 6 256FTGBGA Company: Linx Technologies Inc
XC7VX415T-1FFG1157I
XC7VX415T-1FFG1157I is a type of FPGA (Field Programmable Gate Array) made by Xilinx. This specific FPGA has 1.34 million logic cells, operates at a speed of up to 800 MHz, and features 16 Transceivers,
XC6SLX9-2CSG324C
XC6SLX9-2CSG324C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
XCKU15P-L2FFVE1760E
XCKU15P-L2FFVE1760E Kinex ® UltraScale+ ™ The device can achieve a balance between required system performance and extremely low power consumption, while supporting packet processing and DSP intensive functions, making it an ideal choice for wireless MIMO technology, Nx100G wired networks, as well as data center networks and storage acceleration applications
HI-3584APQI
the HI-3584APQI also features an enhanced ARINC 429 3.3V serial transmitter and dual receivers, providing two receivers each with tag recognition, 32x32 FIFO, and analog line receiver. Each receiver can program up to 16 tags. The independent transmitter also has a 32x32 FIFO function, and the status of all FIFOs can be monitored through external status pins or by querying the status register of HI-3584

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FPC flexible circuit board through hole mode
At present, most of the holes drilled in the double-sided flexible printed board are still drilled by the NC drilling machine. The NC drilling machine is basically the same as that used in the rigid printed board, but the drilling conditions are different. Because the flexible printed board is very thin, multiple pieces can be overlapped for drilling. If the drilling conditions are good, 10 ~ 15 pieces can be overlapped for drilling.
Analysis of the Current Development Status and Prospects of Semiconductor Application Industry in China
In the 1980s, China began to enter the semiconductor industry. In the early days, semiconductor technology mainly relied on imports, while China mainly engaged in simple assembly and testing work. At that time, major enterprises such as Shanghai Hongli and East China Semiconductor had a significant gap between their product technology level and the international advanced level, but it laid the foundation for the Chinese semiconductor industry
What should be paid attention to in PCB proofing?
PCB proofing, also known as PCB proofing, is an important electronic component. It is the main support of electronic components and the provider of electronic component connection
"Electronic Manufacturing Pavilion" of Shenzhen Electronic Equipment Association will become the new highlight of CITE2017
With the emergence of new technologies such as the Internet of Things and cloud computing, a series of new changes have occurred in the manufacturing industry in 2016.
Precautions for FPC flexible circuit board packaging
Special attention should also be paid to the packaging of finished products of flexible circuit boards, rather than simply stacking an appropriate number of flexible boards together at will. Due to the complex structure of flexible printed board
Development of printed circuit board substrate materials
The development of printed circuit board substrate materials has gone through nearly 50 years

XC6SLX45T-2CSG484C Manufacturers

Related Products

Hot Products

XCKU040-2FBVA676E

XC6SLX25-3FT256I

XC7VX415T-1FFG1157I

XC6SLX9-2CSG324C

XCKU15P-L2FFVE1760E

HI-3584APQI

FPC flexible circuit board through hole mode

Analysis of the Current Development Status and Prospects of Semiconductor Application Industry in China

What should be paid attention to in PCB proofing?

"Electronic Manufacturing Pavilion" of Shenzhen Electronic Equipment Association will become the new highlight of CITE2017

Precautions for FPC flexible circuit board packaging

Development of printed circuit board substrate materials

Kitty 2022-08-20 11:03:03

Agatha 2022-12-14 21:55:49

Penelope 2020-06-26 13:43:01

Daphne 2021-03-17 12:54:56

Martin Tesch 2023-08-30 13:44:31

Stephen 2021-07-04 18:00:47

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An Integrated Circuit (IC) functions by integrating various electronic components onto a semiconductor material, typically silicon.

After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.