XC6SLX45-3CSG484C Manufacturers

Quality comes first; service is foremost; business is cooperation" is our business philosophy which is constantly observed and pursued by our company for XC6SLX45-3CSG484C, Welcome your visiting and any your inquires,sincerely hope we can have chance to cooperate with you and we can build up long well business relationship with you.
XC6SLX45-3CSG484C, With many years good service and development, we've a professional international trade sales team. Our products have exported to North America, Europe, Japan, Korea, Australia, New Zealand, Russia and other countries. Looking forward to build up a good and long term cooperation with you in coming future!

Hot Products

  • EP2S60F672I4N

    EP2S60F672I4N

    EP2S60F672I4N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • EP3C55F780I7N

    EP3C55F780I7N

    EP3C55F780I7N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC6SLX16-2CSG324C

    XC6SLX16-2CSG324C

    XC6SLX16-2CSG324C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP1C3T144C8N

    EP1C3T144C8N

    EP1C3T144C8N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU13P-2FHGB2104I

    XCVU13P-2FHGB2104I

    XCVU13P-2FHGB2104I Overview of RF Data Converter Subsystem Most Zynq UltraScale+RFSoCs include an RF data converter subsystem that includes multiple radios Frequency analog-to-digital converter (RF-ADC) and multiple RF analog-to-digital converters
  • High-speed PCB

    High-speed PCB

    high-speed PCB design circuit boards guide for the design of high-speed circuit boards will be of great help engineers.High-Speed PCB Layout TipsApplication BriefSLOA102 - September 2002High-Speed PCB Layout TipsBruce Carter ABSTRACT High-speed op amp circuit design requires special attention.

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