XC6SLX45-2CSG324C Manufacturers

In the past few years, our company absorbed and digested advanced technologies both at home and abroad. Meanwhile, our company staffs a team of experts devoted to the development of XC6SLX45-2CSG324C, Now we have a skilled team for international trade. We will solve the problem you meet. We can present the goods you want. Be sure to feel cost-free to contact us.
XC6SLX45-2CSG324C, With good quality, reasonable price and sincere service, we enjoy a good reputation. Products are exported to South America, Australia, Southeast Asia and so on. Warmly welcome customers at home and abroad to cooperate with us for the brilliant future.

Hot Products

KSZ9031RNXIA-TR
KSZ9031RNXIA-TR is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
XCKU3P-2SFVB784I
XCKU3P-2SFVB784I is a Field-Programmable Gate Array (FPGA) chip from Xilinx's Kintex UltraScale+ family, which is a high-performance FPGA designed with advanced features and capabilities. The chip features 2.6 million logic cells, 2604 DSP slices, and 47 Mb UltraRAM, and is built using a 20nm process technology
XC7K160T-3FFG676E
XC7K160T-3FFG676E is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
Ro4003C PCB
Ro4003c PCB is made of Rogers 4000 series high frequency materials. It has good dielectric properties and very small loss. It should be widely used in microwave, high frequency and RF fields.
10AX115H3F34I2SG
10AX115H3F34I2SG adopts a 20 nanometer process, which can provide high performance, supporting chip to chip data transmission rates of up to 17.4 Gbps, backplane data transmission rates of up to 12.5 Gbps, and up to 1.15 million equivalent logic units.
5CGXFC7D6F27C7N
5CGXFC7D6F27C7N is a Cyclone V GX series FPGA chip produced by Intel (formerly Altera). The chip is packaged in FBGA-672 and has 149500 logic units and 336 I/O ports, supporting system programmability and reprogramming. Its working power supply voltage range is 1.07V to 1.13V

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What characteristics do semiconductor materials possess
Semiconductor materials refer to materials with special electrical properties in electronics and quantum mechanics, including silicon, germanium, silicon nitride, gallium selenide, etc. The special properties of these materials enable them to be used as materials in electronic devices, such as transistors, diodes, solar cells, etc.
Semiconductor refers to a material whose conductivity can be controlled, ranging from insulator to conductor
Semiconductor refers to a material whose conductivity can be controlled from insulator to conductor. No matter from the perspective of science and technology or economic development, the importance of semiconductors is very great. Most of today's electronic products, such as computers, mobile phones or digital recorders, are closely related to semiconductors. Common semiconductor materials include silicon, germanium, gallium arsenide, etc., and silicon is one of the most influential semiconductor materials in commercial applications.
Foxconn changes cage to Phoenix and wants to regain market with 8K
Guo Taiming described its acquisition of Sharp and the introduction of 8K display technology as a replacement for the phoenix. Whether this phoenix can bring Guo Taiming the expected growth and prompt Foxconn to regain the market is still to be verified.
The origin and development of PCB
PCB (printed circuit board), whose Chinese name is printed circuit board, is one of the important components in the electronic industry. Almost every kind of electronic equipment, from electronic watches and calculators to computers,
This year, the cumulative sales of semiconductor equipment in Japan exceeded 75.6 billion, setting a record for the same period in history
According to the news from zhidongxi on June 28, according to money DJ in Taiwan, China, the cumulative sales of semiconductor equipment in Japan exceeded RMB 75.6 billion in May this year, the highest in the same period over the years
What is a semiconductor? What is the current situation of the industry? Which one is stronger in China?
We usually refer to metals with good conductivity such as gold, silver, copper, iron, tin and aluminum as conductors. At the same time, materials with poor conductivity, such as coal, artificial crystals, amber, ceramics, etc., are called insulators. Then, we can simply call the material between the conductor and the insulator semiconductor.

XC6SLX45-2CSG324C Manufacturers

Related Products

Hot Products

KSZ9031RNXIA-TR

XCKU3P-2SFVB784I

XC7K160T-3FFG676E

Ro4003C PCB

10AX115H3F34I2SG

5CGXFC7D6F27C7N

What characteristics do semiconductor materials possess

Semiconductor refers to a material whose conductivity can be controlled, ranging from insulator to conductor

Foxconn changes cage to Phoenix and wants to regain market with 8K

The origin and development of PCB

This year, the cumulative sales of semiconductor equipment in Japan exceeded 75.6 billion, setting a record for the same period in history

What is a semiconductor? What is the current situation of the industry? Which one is stronger in China?

Bruno Cabrera 2024-08-31 11:03:19

Sophia 2020-10-20 08:31:02

Nicci Hackner 2022-02-02 21:44:48

Anne 2023-06-20 00:32:14

Sally 2024-03-02 18:50:06

Molly 2023-11-25 19:31:38

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An Integrated Circuit (IC) functions by integrating various electronic components onto a semiconductor material, typically silicon.

After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.