XC6SLX4-3CPG196I Manufacturers

Sticking for the basic principle of "Super Top quality, Satisfactory service" ,We've been striving to be an excellent business enterprise partner of you for XC6SLX4-3CPG196I, Prospects first! Whatever you require, we should do our utmost to help you. We warmly welcome clients from all around the globe to cooperate with us for mutual enhancement.
XC6SLX4-3CPG196I, We put the product quality and customer's benefits to the first place. Our experienced salesmen supply prompt and efficient service. Quality control group make sure the best quality. We believe quality comes from detail. If you have demand, let us work together to get success.

Hot Products

  • XC6SLX9-3FTG256I

    XC6SLX9-3FTG256I

    XC6SLX9-3FTG256I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6VLX240T-2FFG1156C

    XC6VLX240T-2FFG1156C

    XC6VLX240T-2FFG1156C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • ELIC Rigid-Flex PCB

    ELIC Rigid-Flex PCB

    ELIC Rigid-Flex PCB is the interconnection hole technology in any layer. This technology is the patent process of Matsushita Electric Component in Japan. It is made of short fiber paper of DuPont's "poly aramid" product thermount, which is impregnated with high-function epoxy resin and film. Then it is made of laser hole forming and copper paste, and copper sheet and wire are pressed on both sides to form a conductive and interconnected double-sided plate. Because there is no electroplated copper layer in this technology, the conductor is only made of copper foil, and the thickness of the conductor is the same, which is conducive to the formation of finer wires.
  • XCS20-3TQ144I

    XCS20-3TQ144I

    XCS20-3TQ144I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7V585T-1FFG1761l

    XC7V585T-1FFG1761l

    XC7V585T-1FFG1761l is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7Z030-2FBG676E

    XC7Z030-2FBG676E

    XC7Z030-2FBG676E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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