XC6SLX4-3CPG196I Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • XC6SLX45T-2CSG484C

    XC6SLX45T-2CSG484C

    XC6SLX45T-2CSG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU440-2FLGA2892C

    XCVU440-2FLGA2892C

    ​XCVU440-2FLGA2892C is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, belonging to the Virtex UltraScale series. Here is a brief introduction to the chip:
  • EM-528K High-speed PCB

    EM-528K High-speed PCB

    EM-528K High-speed PCB is almost everywhere in our industry. And, as quoted, we always say that, regardless of the final product or implementation, each PCB is high-speed with its IC technology.
  • Pressfit Hole PCB

    Pressfit Hole PCB

    For example, from the perspective of production process testing, IC testing is generally divided into chip testing, finished product testing, and inspection testing. Unless otherwise required, chip testing generally only conducts DC testing, and finished product testing can have either AC testing or DC testing. In more cases, both tests are available.The following is about Pressfit Hole PCB related, I hope to help you better understand Pressfit Hole PCB.
  • 10AX115H3F34E2SG

    10AX115H3F34E2SG

    ​10AX115H3F34E2SG is an FPGA (Field Programmable Gate Array) chip, belonging to the Arria 10 GX 1150 series, produced by Intel (formerly Altera Corporation). This chip adopts BGA (Ball Grid Array) packaging form, with 504 I/O interfaces and a packaging form of 1152FBGA
  • 10 Layer 4Step HDI PCB

    10 Layer 4Step HDI PCB

    HDI is the English abbreviation of High Density Interconnector, high-density interconnect (HDI) manufacturing printed circuit board. The printed circuit board is a structural element formed by insulating material supplemented by conductor wiring. The following is about 10 Layer 4Step HDI PCB related, I hope to help you better understand 10 Layer 4Step HDI PCB.

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