XC6SLX4-2CSG225C Manufacturers

HDI boards are generally manufactured using a lamination method. The more laminations, the higher the technical level of the board. Ordinary HDI boards are basically laminated one time. High-level HDI adopts two or more layered technologies. At the same time, advanced PCB technologies such as stacked holes, electroplated holes, and direct laser drilling are used. The following is about 8 Layer Robot HDI PCB related, I hope to help you better understand 8 Layer Robot HDI PCB.

5CSXFC2C6U23I7N is dual ARM ® Cortex®-A9 MPCore ™ With CoreSight System on Chip (SOC) IC, Cyclone ® V SE FPGA -25K logic element, 800MHz, 672-UBGA (23x23)

XCAU15P-1FFVB676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

10CL120YF484I7G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications. 10CL120YF484I7G is commonly used in applications such as industrial automation, gaming, and low-power embedded systems. The device is known for its low power consumption, low cost, and high processing capacity, making it an excellent choice for applications where cost and power consumption are critical factors.

BCM43694B1KRFBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

​XCAU10P-1SBVB484I is a cost optimized device with the highest serial bandwidth and signal computing density, suitable for critical network applications, visual and video processing, and secure connections