XC6SLX25T-2CSG324C Manufacturers

We insist on offering high-quality output with superior small business concept, honest profits along with the best and fast service. it will bring you not only the top quality product and huge profit, but one of the most significant will be to occupy the endless market for XC6SLX25T-2CSG324C, We often hold the philosophy of win-win, and establish long-term cooperation connection with consumers from around the planet.We think that our expansion base on customer's achievement, credit rating is our daily life.
XC6SLX25T-2CSG324C, We are going to supply much better items with diversified designs and professional services. We sincerely welcome friends from over the world to visit our company and cooperate with us on the basis of long-term and mutual benefits.

Hot Products

  • 4.25g Optical Module PCB

    4.25g Optical Module PCB

    The main reason for using SFF on the ONU side is that the ONU products of the EPON system are usually placed on the user side and require fixed, not hot-swappable. With the rapid development of PON technology, SFF is gradually replaced by BOB.The following is about 4.25g Optical Module PCB related, I hope to help you better understand 4.25g Optical Module PCB.
  • XCVU190-2FLGB2104I

    XCVU190-2FLGB2104I

    ​XCVU190-2FLGB2104I Virtex ® UltraScale FPGAs: High capacity, high-performance FPGAs implemented using single-chip and next-generation SSI technology. Virtex UltraScale devices achieve the highest system capacity, bandwidth, and performance by integrating various system level functionalities to meet critical market and application requirements.
  • XC3S400-4PQG208I

    XC3S400-4PQG208I

    XC3S400-4PQG208I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Heavy copper PCB

    Heavy copper PCB

    Printed circuit boards are usually bonded with a layer of copper foil on glass epoxy substrate. The thickness of copper foil is usually 18 μ m, 35 μ m, 55 μ m and 70 μ M. The most commonly used copper foil thickness is 35 μ M. When the weight of copper is more than 70UM, it is called heavy copper PCB
  • 40-layer M6G high speed PCB

    40-layer M6G high speed PCB

    When the 40-layer M6G high speed PCB is close to the parallel high-speed differential signal line pair, in the case of impedance matching, the coupling of the two lines will bring many advantages. However, it is believed that this will increase the attenuation of the signal and affect the transmission distance.
  • 10M08DFV81I8G

    10M08DFV81I8G

    10M08DFV81I8G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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