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XC6SLX25-3FTG256I Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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    XCVU11P-3FSGD2104E

    ​XCVU11P-3FSGD2104E is an FPGA (Field Programmable Gate Array) produced by Xilinx Corporation. This FPGA has the following features and specifications:
  • XCVU29P-2FSGA2577I

    XCVU29P-2FSGA2577I

    ​XCVU29P-2FSGA2577I is an electronic component from Xilinx, specifically part of the UltraScale+FPGA (Field Programmable Gate Array) series. The following is a detailed introduction to XCVU29P-2FSGA2577I:
  • XC7Z045-2FBG676I

    XC7Z045-2FBG676I

    XC7Z045-2FBG676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Mixed HDI PCB of RO4003C

    Mixed HDI PCB of RO4003C

    High-frequency substrates, satellite systems, mobile phone receiving base stations and other communication products must use high-frequency circuit boards, which will inevitably develop rapidly in the next few years, and high-frequency substrates will be in large demand. The following is about Mixed HDI PCB of RO4003C related, I hope to help you better understand Mixed HDI PCB of RO4003C.
  • TU-752 High-speed PCB

    TU-752 High-speed PCB

    TU-752 High-speed PCB digital circuit has high frequency and strong sensitivity of analog circuit. For signal line, high frequency signal line should be far away from sensitive analog circuit device as far as possible. For ground wire, the whole PCB has only one node to the outside world. Therefore, it is necessary to deal with the problem of common ground of digital and analog in PCB, while in the board, digital ground and analog ground are actually separated, and they are not mutually related Connection is only at the interface between PCB and the outside world (such as plug, etc.). There is a little short circuit between digital ground and analog ground, please note that there is only one connection point. Some of them are not grounded on the PCB, which is decided by the system design.
  • MT47H64M8SH-25E:H

    MT47H64M8SH-25E:H

    ​MT47H64M8SH-25E:H is a type of synchronous dynamic random-access memory (SDRAM) chip produced by Micron Technology. It has a capacity of 512 megabytes (MB) and a maximum clock speed of 200 megahertz (MHz). The chip operates at a voltage of 2.5
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    Therefore, PCB manufacturers will leave a small point. The length of the left STUB is called B value, which is generally in the range of 50-150UM.

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    Via hole is also called via hole. In order to meet customer requirements, the via holes must be plugged in the PCB process. Through practice, it has been found that in the process of plugging, if the traditional aluminum sheet plugging process is changed, and the white mesh is used to complete the board surface solder mask and plugging, the PCB production can be stable and the quality is reliable.

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    High Density Interconnection (HDI) PCB is a kind of (technology) for the production of printed circuit boards. It is a circuit board with relatively high circuit distribution density using micro blind via and buried via technology.

  • Processing of FPC soft plate and reinforcing plate

    FPC soft board reinforced board processing, FPC soft board reinforced board is unique to flexible circuit board, and its shape and materials are also diverse

  • What Are Multilayer Boards?

    Multi-layer PCB is a circuit board composed of more than two layers of electrical layer (copper foil layer) superimposed on each other. The copper layers are bonded together by layers of resin.

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