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XC6SLX150-3FGG676I Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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    BCM56321B1KFSBLG

    BCM56321B1KFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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    XC7A35T-2FGG484C

    XC7A35T-2FGG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Ic carrier

    Ic carrier

    IC carrier: generally, it is a board on the chip. The board is very small, generally, it is 1/4 nail cover size, and the board is very thin 0.2-0. The material used is FR-5, BT resin, and its circuit is about 2mil / 2mil. For high-precision boards, it used to be produced in Taiwan, but now it is developing to the mainland.
  • XC7Z010-2CLG225I

    XC7Z010-2CLG225I

    ​XC7Z010-2CLG225I Adopting a dual core ARM Cortex-A9 processor configuration, it integrates 7 series programmable logic (up to 6.6M logic units and 12.5Gb/s transceivers), providing highly differentiated design for various embedded applications
  • Red High speed Backplane

    Red High speed Backplane

    Traditionally, for reliability reasons, passive components have tended to be used on the backplane. However, in order to maintain the fixed cost of the active board, more and more active devices such as BGA are designed on the backplane.The following is about Red High speed Backplane. related, I hope to help you better understand Red High speed Backplane.
  • XCVU190-3FLGA2577E

    XCVU190-3FLGA2577E

    ​XCVU190-3FLGA2577E is a high-performance FPGA chip belonging to Xilinx's Virtex UltraScale series. This chip has 2349900 logic units and 568 input/output terminals, manufactured using a 20nm process, and packaged in 2577 pin FCBGA.
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