XC6SLX150-3FGG676I Manufacturers

In the past few years, our company absorbed and digested advanced technologies both at home and abroad. Meanwhile, our company staffs a team of experts devoted to the development of XC6SLX150-3FGG676I, Now we have a skilled team for international trade. We will solve the problem you meet. We can present the goods you want. Be sure to feel cost-free to contact us.
XC6SLX150-3FGG676I, Our products and solutions are exported worldwide. Our customers are always satisfied with our reliable quality, customer-oriented services and competitive prices. Our mission is "to continue to earn your loyalty by dedicating our efforts to the constant improvement of our solutions and services in order to ensure the satisfaction of our end-users, customers, employees, suppliers and the worldwide communities in which we cooperate".

Hot Products

  • XC3SD1800A-4CSG484I

    XC3SD1800A-4CSG484I

    XC3SD1800A-4CSG484I is a high-performance field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 1.8 million system gates, 624 user input/ output pins, and 288 DSP slices, making it ideal for high-performance applications. It operates on a 1.2V to 1.5V power supply and supports various I/O standards such as LVCMOS, PCI, and SSTL. The device has a maximum operating frequency of 250 MHz.
  • Ro3003 Material

    Ro3003 Material

    Ro3003 Material is a high frequency circuit material filled with PTFE composite material, which is used in commercial microwave and RF applications. The product series aims to provide excellent electrical and mechanical stability at competitive prices. Rogers ro3003 has excellent dielectric constant stability over the entire temperature range, including eliminating the change of dielectric constant when using PTFE glass at room temperature. In addition, the loss coefficient of the ro3003 laminate is as low as 0.0013 to 10 GHz.
  • BCM56873A0KFSBG

    BCM56873A0KFSBG

    BCM56873A0KFSBG Availability and lead times may vary depending on suppliers and market conditions. Some sources indicate a lead time of 7 days for small quantities, while larger orders may require negotiation.The product is available through various distributors and suppliers, including Alibaba.com and Mouser Electronics.
  • XCVU9P-1FLGC2104I

    XCVU9P-1FLGC2104I

    ​XCVU9P-1FLGC2104I is an FPGA (Field Programmable Gate Array) chip, specifically belonging to Xilinx's product line. Here is a brief introduction to the chip:
  • GA104-875-A1

    GA104-875-A1

    GA104-875-A1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 24G RO4003C RF PCB

    24G RO4003C RF PCB

    The RF module is designed with RO4003C 20mil thickness PCB board, but RO4003C does not have UL certification. Can some applications requiring UL certification be replaced by RO4350B with the same thickness?The following is about 24G RO4003C RF PCBrelated, I hope to help you better understand 24G RO4003C RF PCB

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