XC6SLX100T-3FGG900C Manufacturers

Our solutions are greatly recognized and reliable by customers and will fulfill continuously altering financial and social requirements for XC6SLX100T-3FGG900C, We've been prepared to cooperate with company friends from at your home and overseas and produce a wonderful future with each other.
XC6SLX100T-3FGG900C, Our products and solutions are exported worldwide. Our customers are always satisfied with our reliable quality, customer-oriented services and competitive prices. Our mission is "to continue to earn your loyalty by dedicating our efforts to the constant improvement of our solutions and services in order to ensure the satisfaction of our end-users, customers, employees, suppliers and the worldwide communities in which we cooperate".

Hot Products

  • XCZU9CG-2FFVC900I

    XCZU9CG-2FFVC900I

    ​XCZU9CG-2FFVC900I is a high-performance FPGA chip launched by Xilinx, which integrates rich functions and powerful performance, suitable for various complex application scenarios. Here are some of the main features and functions of the chip:
  • High Thermal Conductivity PCB

    High Thermal Conductivity PCB

    The high thermal conductivity FR4 circuit board usually guides the thermal coefficient to be greater than or equal to 1.2, while the thermal conductivity of ST115D reaches 1.5, the performance is good, and the price is moderate. The following is about High Thermal Conductivity PCB related, I hope to help you better understand High Thermal Conductivity PCB.
  • XC3S1500-5FGG320C

    XC3S1500-5FGG320C

    XC3S1500-5FGG320C is a field programmable gate array (FPGA) product produced by Xilinx (AMD/Xilinx, note that AMD acquired Xilinx at certain times)
  • BCM58625BB1KF12G

    BCM58625BB1KF12G

    BCM58625BB1KF12G is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10M16DAF256C8G

    10M16DAF256C8G

    ​10M16DAF256C8G is an FPGA (Field Programmable Logic Device) produced by Intel/Altera, belonging to the MAX 10 series. This FPGA has the following features and specifications: Number of logical elements: It has 16000 logical elements, including 1000 LAB (logical array blocks). Number of input/output terminals: Provide 178 input/output terminals.
  • EP2AGX190FF35I3G

    EP2AGX190FF35I3G

    EP2AGX190FF35I3G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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