XC6SLX100T-3FGG484I Manufacturers

We believe that long expression partnership is often a result of top of the range, value added service, prosperous encounter and personal contact for XC6SLX100T-3FGG484I, Are you still on the lookout for a good quality product that is in accordance together with your very good organization image while expanding your item range? Consider our quality merchandise. Your choice will prove to be intelligent!
XC6SLX100T-3FGG484I, Our company always provides good quality and reasonable price for our customers. In our efforts, we already have many shops in Guangzhou and our solutions have won praise from customers worldwide. Our mission has always been simple: To delight our customers with best quality hair solutions and deliver on time. Welcome new and old customers to contact us for the future long term business relationships.

Hot Products

  • XC7A50T-1CSG324C

    XC7A50T-1CSG324C

    XC7A50T-1CSG324C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCKU085-3FLVA1517E

    XCKU085-3FLVA1517E

    ​XCKU085-3FLVA1517E is a high-performance FPGA product from Xilinx, packaged in BGA-1517. This FPGA has an astonishing 1088325 logic components, enabling it to handle extremely complex logic operations. Meanwhile, it has 672 I/O ports, making data transmission and interaction more efficient.
  • 5CSEBA6U19I7N

    5CSEBA6U19I7N

    ​5CSEBA6U19I7N is a SoC FPGA (Field Programmable Gate Array) produced by Altera (Intel), which has high performance and rich functional features. Here is a detailed introduction about 5CSEBA6U19I7N
  • ELIC Rigid-Flex PCB

    ELIC Rigid-Flex PCB

    ELIC Rigid-Flex PCB is the interconnection hole technology in any layer. This technology is the patent process of Matsushita Electric Component in Japan. It is made of short fiber paper of DuPont's "poly aramid" product thermount, which is impregnated with high-function epoxy resin and film. Then it is made of laser hole forming and copper paste, and copper sheet and wire are pressed on both sides to form a conductive and interconnected double-sided plate. Because there is no electroplated copper layer in this technology, the conductor is only made of copper foil, and the thickness of the conductor is the same, which is conducive to the formation of finer wires.
  • 13 layer R5775G high-speed PCB

    13 layer R5775G high-speed PCB

    In the design of 13 layer R5775G high-speed PCB, the main problems that must be considered are signal integrity, electromagnetic compatibility and thermal noise. Generally, when the signal frequency is higher than 30MHz, the signal distortion must be prevented. When the frequency is higher than 66MHz, the signal integrity must be analyzed.
  • XC6SLX45T-3CSG484C

    XC6SLX45T-3CSG484C

    XC6SLX45T-3CSG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

Send Inquiry