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XC5VLX50T-1FFG665I Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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    XCAU15P-1FFVB676I

    XCAU15P-1FFVB676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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    10CL016YF484I7G

    ​10CL016YF484I7G Intel 10CL016YF484I7G Cyclone ® The 10 LP FPGA has been optimized for low cost and low static power consumption, making it an ideal choice for large-scale and cost sensitive applications. The Intel Cyclone 10 LP device provides high-density programmable gates, onboard resources, and general-purpose I/O. These resources can meet the requirements of I/O expansion and chip to chip interface
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    XC7Z030-2SBG485I

    ​The XC7Z030-2SBG485I Zynq-7000 device is equipped with a dual core ARM Cortex-A9 processor, which is compatible with 28nm Artix7 or Kinex based processors ™ The programmable logic integration of 7 can achieve excellent performance to power ratio and maximum design flexibility. The Zynq 7000 device has a logic unit of up to 6.25M and transceivers ranging from 6.6Gb/s to 12.5Gb/s, which can achieve highly differentiated design for many embedded applications such as multi camera driver assistance systems and 4K2K ultra high definition televisions
  • 5CGXFC5F6M11I7N

    5CGXFC5F6M11I7N

    5CGXFC5F6M11I7N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX150-3FGG676I

    XC6SLX150-3FGG676I

    ​XC6SLX150-3FGG676I Packaging BGA integrated circuit chips, IC electronic components, inquiry and order placement
  • XC6SLX100-2FGG484C

    XC6SLX100-2FGG484C

    XC6SLX100-2FGG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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