XC5VLX110T-1FFG1136I Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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ADS1112IDRCR
ADS1112IDRCR is a precision analog-to-digital converter (ADC) developed by Texas Instruments, a leading semiconductor technology company. This device features a 16-bit resolution, which provides high-precision conversion for analog signals. The device operates on a single power supply ranging from 2.0V to 5.5V and consumes very low power.
XCKU115-2FLVA1517E
XCKU115-2FLVA1517E is an FPGA chip produced by Xilinx, belonging to the Kintex UltraScale architecture, with high performance and low power consumption characteristics. This chip adopts second-generation 3D integrated circuit technology and has over 1.5 million system logic units and 624 input/output ports, which can be flexibly configured for various applications
HDI PCB
HDI PCB is the abbreviation of "high density interconnector", which is a kind of printed circuit board (PCB) production. It is a kind of circuit board with high line distribution density using micro blind buried hole technology.
XC7A35T-1CSG325I
XC7A35T-1CSG325I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
XC7K160T-1FFG676I
XC7K160T-1FFG676I is an FPGA chip produced by Xilinx, belonging to the Kintex-7 series, with the following main features and parameters:
XC6SLX100-2FGG676C
XC6SLX100-2FGG676C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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Reviews

Distinguishing method of PCB single-layer board and multi-layer board
According to the number of layers, single-sided, double-sided and multilayer circuit boards are divided according to the circuit layer inside.
Chip Principles and Quantum Mechanics
Many illiterates believe that quantum mechanics is just a mathematical game with no practical value. Haha, let's find a ancestor for computer chips, please take a look at the demonstration:
The global PCB market size is nearly $800 in the next five years
Printed circuit board (PCB) is a board made of insulating and heat-insulating materials with a certain strength, which is fixed in the circuit and provides the connecting circuit between various components.
Hong Hai OEM production line blessing Sharp may return to the Japanese PC market
Hong Hai cooperates with Sharp, and the outside world is most concerned about in the field of display panels, but the level of cooperation between the two parties is not only this.
The source of the name of the HDI Board
HDI in HDI Board is the abbreviation of High Density Interconnector. It is a kind of (technology) for producing printed circuit boards. It uses micro-blind and buried via technology for a circuit board with a relatively high line distribution density. HDI is a compact product designed for small-capacity users.
The Evolution and Impact of Integrated Circuits in Modern Electronics
The concept of integrated circuits traces its roots back to the late 1950s and early 1960s. Jack Kilby, an engineer at Texas Instruments, and Robert Noyce, co-founder of Fairchild Semiconductor and later Intel, independently conceived the idea of integrating multiple electronic components onto a single semiconductor substrate.

XC5VLX110T-1FFG1136I Manufacturers

Related Products

Hot Products

ADS1112IDRCR

XCKU115-2FLVA1517E

HDI PCB

XC7A35T-1CSG325I

XC7K160T-1FFG676I

XC6SLX100-2FGG676C

Distinguishing method of PCB single-layer board and multi-layer board

Chip Principles and Quantum Mechanics

The global PCB market size is nearly $800 in the next five years

Hong Hai OEM production line blessing Sharp may return to the Japanese PC market

The source of the name of the HDI Board

The Evolution and Impact of Integrated Circuits in Modern Electronics

Alexander 2021-05-18 18:47:15

Lee 2022-02-04 08:08:48

Clara 2024-04-05 03:30:42

ROGER Rivkin 2024-10-05 15:21:48

Fanny 2022-12-28 07:52:33

Eileen 2020-06-14 11:44:57

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An Integrated Circuit (IC) functions by integrating various electronic components onto a semiconductor material, typically silicon.

After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.