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The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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  • Buried capacitance PCB

    Buried capacitance PCB

    24-Layer Buried capacitance PCB has a process called burying resistance, which is to put chip resistors and chip capacitors into the inner layer of the PCB board. These chip resistors and capacitors are generally very small, such as 0201, or even smaller 01005. The PCB board produced in this way is the same as a normal PCB board, but a lot of resistors and capacitors are placed in it. For the top layer, the bottom layer saves a lot of space for component placement. The following is about 24 Layer Buried capacitance PCB related, I hope to help you better understand 24 Layer Buried capacitance PCB.
  • 10AX027E3F29E2SG

    10AX027E3F29E2SG

    ​10AX027E3F29E2SG is an FPGA (Field Programmable Gate Array) product produced by Altera (now acquired by Intel), with the specific model being Arria 10 GX 270. This FPGA has the following features and specifications
  • XCVU29P-1FSGA2577E

    XCVU29P-1FSGA2577E

    ​XCVU29P-1FSGA2577E is an FPGA chip produced by Xilinx, belonging to the Virtex UltraScale+series. This chip has the characteristics of high performance and low power consumption, and is suitable for various application scenarios, such as data centers, communications, industrial control, and other fields. The XCVU29P-1FSGA2577E adopts advanced 20nm technology and is packaged in the form of 2577 pin FCBGA,
  • Pressfit Hole PCB

    Pressfit Hole PCB

    For example, from the perspective of production process testing, IC testing is generally divided into chip testing, finished product testing, and inspection testing. Unless otherwise required, chip testing generally only conducts DC testing, and finished product testing can have either AC testing or DC testing. In more cases, both tests are available.The following is about Pressfit Hole PCB related, I hope to help you better understand Pressfit Hole PCB.
  • 24G RO4003C RF PCB

    24G RO4003C RF PCB

    The RF module is designed with RO4003C 20mil thickness PCB board, but RO4003C does not have UL certification. Can some applications requiring UL certification be replaced by RO4350B with the same thickness?The following is about 24G RO4003C RF PCBrelated, I hope to help you better understand 24G RO4003C RF PCB
  • XC3S400-5TQ144C

    XC3S400-5TQ144C

    XC3S400-5TQ144C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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  • T/CPCA 6044-2017 "Printed Board Safety Performance Specification" Release Notice

    With the development of printed circuit board technology and its applications, the industry has put forward more new requirements for the safety of printed circuit boards. Therefore, it is necessary to establish a safety standard that belongs to China's printed circuit boards.

  • How to design the Rigid-Flex PCB better?

    With the continuous upgrading of electronic products and the gradual application of 5G products, the demand for Rigid-Flex PCB has increased. There is a big difference between designing Rigid-Flex PCB and simply designing Flex-PCB and Rigid-PCB.The following is a detailed description of some requirements for the design of conventionalRigid-Flex PCB.

  • Multilayer PCB laminated structure

    Before designing multi-layer PCB, the designer needs to first determine the circuit board structure according to the scale of the circuit

  • PCB wiring

    Wiring is the most important process in the entire PCB design.

  • XCVU9P-L2FLGA2577E is a powerful and high-performance FPGA chip

    XCVU9P-L2FLGA2577E adopts the advanced Virtex UltraScale+architecture and is a member of this series of chips.

  • The characteristics of rigid-flex board

    Rigid-flex board is a combination of flexible board and hard board. It is a circuit board formed by combining a thin layered flexible bottom layer with a rigid bottom layer, and then laminating it into a single component.The flexible board is used to replace the cable assembly to complete the highly reliable connection and transmission of power and electrical signals.The product can work stably and reliably for a long time under harsh environments such as high and low temperature, high humidity, vibration, salt spray, and low air pressure. At present, Jonhon Optronic has provided rigid and flexible printed board solutions for aviation, aerospace, ships, weapons and other fields.

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