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XC3SD3400A-4CSG484I Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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  • 10CL120YF484I7G

    10CL120YF484I7G

    10CL120YF484I7G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications. 10CL120YF484I7G is commonly used in applications such as industrial automation, gaming, and low-power embedded systems. The device is known for its low power consumption, low cost, and high processing capacity, making it an excellent choice for applications where cost and power consumption are critical factors.
  • XC7A50T-1FGG484I

    XC7A50T-1FGG484I

    ​XC7A50T-1FGG484I is a high-performance, step-down DC-DC power module developed by Analog Devices, a leading semiconductor technology company. This device features a wide input voltage range of 6V to 36V and a maximum output current of 5A.
  • XCZU27DR-2FFVE1156I

    XCZU27DR-2FFVE1156I

    ​XCZU27DR-2FFVE1156I integrates a single chip direct RF sampling data converter on an adaptive SoC, eliminating the need for external data converters, thus achieving a highly flexible solution. Compared with multi-component solutions, this solution can reduce power consumption and space occupation by 50%, including eliminating high power FPGA analog interfaces such as JESD204
  • XC3S1400AN-4FGG676I

    XC3S1400AN-4FGG676I

    XC3S1400AN-4FGG676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • RF-35TC PCB

    RF-35TC PCB

    Rf-35TC PCB is Taconic high thermal conductivity low loss laminate, high Tc, DK 3.5 substrate, DF 0.0011, is a good choice for high frequency, radio frequency, Microwave PCB
  • BCM56680B1KFSBLG

    BCM56680B1KFSBLG

    BCM56680B1KFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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