XC3S700A-4FGG484C Manufacturers

XC7S100-2FGGA484I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

​10M02SCU169I7G is a MAX 10 series FPGA chip produced by Intel (formerly Altera). This chip belongs to the field programmable gate array (FPGA) and has non-volatile characteristics. It provides 130 I/O ports and is packaged in UBGA-169. It supports a working voltage of 3.3V, a working temperature range of -40 ° C to+100 ° C, and a maximum working frequency of 450MHz.

EP3C55U484I7N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

XC6SLX25-2CSG324I has various speed levels, with -3 having the highest performance. The DC and AC electrical parameters of the automotive XA Spartan-6 FPGAs and defense grade Spartan-6Q FPGAs devices are equivalent to commercial specifications, unless otherwise specified. The timing characteristics of commercial (XC) -2 speed level industrial devices are the same as those of commercial -2 speed level devices- The 2Q and -3Q speed levels are specifically designed for expanding the (Q) temperature range. The timing characteristics are comparable to those of the -2 and -3 speed levels of automotive and defense grade devices. Product attributes

EP2AGX95EF35I5G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

BCM89883B1BFBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.