Products
Home > Products > XC3S50A-4VQG100I

XC3S50A-4VQG100I Manufacturers

It really is a good way to further improve our goods and service. Our mission would be to acquire inventive items to buyers with a very good encounter for XC3S50A-4VQG100I, We are keeping durable business relationships with more than 200 wholesalers in the USA, the UK, Germany and Canada. If you are interested in any of our products, please feel free to contact us.
XC3S50A-4VQG100I, Based on our automatic production line, steady material purchase channel and quick subcontract systems have been built in mainland China to meet customer's wider and higher requirement in recent years. We have been looking forward to cooperating with more clients worldwide for common development and mutual benefit!Your trust and approval are the best reward for our efforts. Keeping honest, innovative and efficient, we sincerely expect that we can be business partners to create our brilliant future!

Related Products

Hot Products

  • MT41K256M8DA-125:K

    MT41K256M8DA-125:K

    MT41K256M8DA-125:K is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • RO4350B PCB

    RO4350B PCB

    The high-frequency control board is mainly composed of a high-frequency induction heating main control board and two drives. The high-frequency board technology uses SG3525A as a PWM pulse. The output pulse frequency range is 20KHZ-60KHZ, the pulse interval is 180 degrees, and the dead time You can adjust it yourself. The following is about Double sided RO4350B PCB related, I hope to help you better understand Double sided RO4350B PCB.
  • 5CGXFC4C6F23C6N

    5CGXFC4C6F23C6N

    5CGXFC4C6F23C6N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S1000-4FTG256C

    XC3S1000-4FTG256C

    XC3S1000-4FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S1200E-4FGG400C

    XC3S1200E-4FGG400C

    XC3S1200E-4FGG400C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 10M25SCE144I7G

    10M25SCE144I7G

    10M25SCE144I7G is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Related Blog
  • Reviews

  • Distinguishing method of PCB single-layer board and multi-layer board

    According to the number of layers, single-sided, double-sided and multilayer circuit boards are divided according to the circuit layer inside.

  • Features of PCB

    The reason why PCB can be used more and more widely is because it has many unique advantages

  • The Function and Principle of Chips

    The main function of a chip is to complete calculations and processing tasks, and an integrated circuit is to package a circuit onto a small component.

  • What are the application scenarios of HDI PCB?

    High-Density Interconnect (HDI) PCBs enable revolutionary advancements in electronics by packing intricate circuitry into compact designs. As a leader in HDI PCB manufacturing, HONTEC delivers demanding precision-edge solutions for industries demanding precision, reliability, and rapid innovation. With certifications including UL, SGS, and ISO9001, and streamlined logistics via UPS/DHL, we empower cutting clients across 28 countries. Below, we explore HDI PCB applications, technical specifications, and industry-specific benefits.

  • Current status of semiconductor chips in China

    What is the status of Chinese chips On June 9, 2021, at the world semiconductor conference, Wu Hanming, an academician of the Chinese Academy of engineering, pointed out the current situation of China's chips: China still needs 8 SMIC's if it wants to complete the localization and replacement of chips. In short, now China needs 8 SMIC's

  • How Does High Frequency PCB Design Minimize Signal Loss and Interference

    At the core of solving this challenge lies the High Frequency Board. At HONTEC, we specialize in crafting these critical components, turning theoretical design principles into tangible, high-reliability products that meet the rigorous demands of today’s technology.

Send Inquiry