XC3S250E-4FTG256C Manufacturers

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XC3S250E-4FTG256C, We believe with our consistently excellent service you can get the best performance and cost least goods from us for a long term . We commit to offer better services and create more value to all our customers. Hope we can create a better future together.

Hot Products

  • XA7A50T-1CSG324Q

    XA7A50T-1CSG324Q

    XA7A50T-1CSG324Q is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • BCM5221A4KMLG

    BCM5221A4KMLG

    BCM5221A4KMLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC2S200-5PQG208C

    XC2S200-5PQG208C

    XC2S200-5PQG208C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 16-layer Rigid-Flex PCB

    16-layer Rigid-Flex PCB

    The designer of 16-layer Rigid-Flex PCB can use a single component to replace the composite printed circuit board which is composed of multiple connectors, multiple cables and ribbon cables. The performance is stronger and the stability is higher. At the same time, the scope of design is limited to one component, and the available space is optimized by bending and folding lines like a paper swan.
  • XCVU13P-1FLGA2577E

    XCVU13P-1FLGA2577E

    ​XCVU13P-1FLGA2577E is an FPGA (Field Programmable Gate Array) product launched by Xilinx. This product belongs to the UltraScale+architecture, designed to meet a wide range of system requirements, with a particular focus on reducing total power consumption through multiple innovative technologies
  • MT41K128M16JT-125AAT:K

    MT41K128M16JT-125AAT:K

    ​MT41K128M16JT-125AAT:K is a type of dynamic random-access memory (DRAM) module commonly used in computer systems. It has a capacity of 2 GB and a data transfer rate of 1600 megatransfers per second (MT/s).

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