XC3S1400A-4FGG484I Manufacturers

Our goal will be to offer premium quality items at competitive price ranges, and top-notch support to consumers around the planet. We are ISO9001, CE, and GS certified and strictly adhere to their high quality specifications for XC3S1400A-4FGG484I, Only for accomplish the good-quality product to meet customer's demand, all of our products have been strictly inspected before shipment.
XC3S1400A-4FGG484I, With the goal of "zero defect". To care for the environment, and social returns, care employee social responsibility as own duty. We welcome friends from all over the world to visit and guide us so that we can achieve the win-win goal together.

Hot Products

XCVU3P-2FFVC1517I
XCVU3P-2FFVC1517I is a high-performance FPGA based on 14nm/16nm FinFET nodes, supporting 3D IC technology and various computationally intensive applications.
STM32F415RGT6
STM32F415RGT6 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
XC7VX980T-1FF1930C
XC7VX980T-1FF1930C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
5SGXMA3H2F35I3LG
5SGXMA3H2F35I3LG is a field programmable gate array (FPGA) chip designed and produced by Intel (formerly Altera Corporation). Here is a brief introduction to the chip:
XC6SLX25T-2CSG324I
XC6SLX25T-2CSG324I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
GA102-895-A1
GA102-895-A1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

Related Blog
Reviews

When designing a four-layer PCB circuit board, how is the stack-up generally designed?
When designing a four-layer PCB circuit board, how is the stack-up generally designed?
What should be paid attention to in PCB proofing?
PCB proofing, also known as PCB proofing, is an important electronic component. It is the main support of electronic components and the provider of electronic component connection
Development history of electronic components
The development history of electronic components is actually a condensed history of electronic development. Electronic technology is a new technology developed at the end of the 19th century and the beginning of the 20th century. It has developed most rapidly and been widely used in the 20th century. It has become an important symbol of the development of modern science and technology.
Detailed explanation of PCB circuit board via clogging solution
Via hole is also called via hole. In order to meet customer requirements, the via holes must be plugged in the PCB process. Through practice, it has been found that in the process of plugging, if the traditional aluminum sheet plugging process is changed, and the white mesh is used to complete the board surface solder mask and plugging, the PCB production can be stable and the quality is reliable.
Distinguishing method of PCB single-layer board and multi-layer board
According to the number of layers, single-sided, double-sided and multilayer circuit boards are divided according to the circuit layer inside.
What are the characteristics of semiconductor materials?
The resistivity of semiconductors changes significantly with temperature. For example, pure germanium, for every 10 degrees increase in humidity, its electrical resistivity decreases to 1/2 of its original value.

XC3S1400A-4FGG484I Manufacturers

Related Products

Hot Products

XCVU3P-2FFVC1517I

STM32F415RGT6

XC7VX980T-1FF1930C

5SGXMA3H2F35I3LG

XC6SLX25T-2CSG324I

GA102-895-A1

When designing a four-layer PCB circuit board, how is the stack-up generally designed?

What should be paid attention to in PCB proofing?

Development history of electronic components

Detailed explanation of PCB circuit board via clogging solution

Distinguishing method of PCB single-layer board and multi-layer board

What are the characteristics of semiconductor materials?

Phoenix 2024-05-05 03:36:37

Adela 2024-05-12 11:47:22

Marian 2020-07-14 01:59:15

Olive 2021-01-20 21:29:11

Tyler Larson 2023-11-08 06:13:34

Moira 2023-05-18 18:28:42

Send Inquiry

An Integrated Circuit (IC) functions by integrating various electronic components onto a semiconductor material, typically silicon.

After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.