XC3S1200E-4FTG256C Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • XCKU15P-L2FFVE1760E

    XCKU15P-L2FFVE1760E

    ​XCKU15P-L2FFVE1760E Kinex ® UltraScale+ ™ The device can achieve a balance between required system performance and extremely low power consumption, while supporting packet processing and DSP intensive functions, making it an ideal choice for wireless MIMO technology, Nx100G wired networks, as well as data center networks and storage acceleration applications
  • HDI PCB

    HDI PCB

    HDI PCB is the abbreviation of "high density interconnector", which is a kind of printed circuit board (PCB) production. It is a kind of circuit board with high line distribution density using micro blind buried hole technology.
  • EP4SGX110HF35C3G

    EP4SGX110HF35C3G

    EP4SGX110HF35C3G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7Z045-3FFG676E

    XC7Z045-3FFG676E

    XC7Z045-3FFG676E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Megtron4 PCB

    Megtron4 PCB

    Many properties of megtron4 PCB developed by Panasonic include high frequency performance, eye diagram test, through hole reliability, CAF resistance, IVH filling performance, lead-free compatibility, drilling performance and slag removal performance
  • XC7Z045-2FFG676E

    XC7Z045-2FFG676E

    ​XC7Z045-2FFG676E is a high-performance FPGA chip launched by Xilinx, which has the characteristics of high-speed processing capability, low power consumption, and high integration, and is suitable for various applications in modern communication systems. This chip is based on the ARM Cortex-A9 core

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