XC3S1200E-4FGG400C Manufacturers

With our abundant experience and considerate products and services, we have been recognized to be a reputable supplier for a lot of global consumers for XC3S1200E-4FGG400C, Our workforce members are intention to provides products and solutions with large performance cost ratio to our shoppers, as well as the goal for all of us would be to satisfy our consumers from everywhere in the globe.
XC3S1200E-4FGG400C, Satisfaction and good credit to every customer is our priority. We focus on every detail of order processing for customers till they have received safe and sound products with good logistics service and economical cost. Depending on this, our products and solutions are sold very well in the countries in Africa, the Mid-East and Southeast Asia.

Hot Products

  • ELIC Rigid-Flex PCB

    ELIC Rigid-Flex PCB

    ELIC Rigid-Flex PCB is the interconnection hole technology in any layer. This technology is the patent process of Matsushita Electric Component in Japan. It is made of short fiber paper of DuPont's "poly aramid" product thermount, which is impregnated with high-function epoxy resin and film. Then it is made of laser hole forming and copper paste, and copper sheet and wire are pressed on both sides to form a conductive and interconnected double-sided plate. Because there is no electroplated copper layer in this technology, the conductor is only made of copper foil, and the thickness of the conductor is the same, which is conducive to the formation of finer wires.
  • 5CGXFC9E6F35C7N

    5CGXFC9E6F35C7N

    ​5CGXFC9E6F35C7N is an FPGA chip belonging to the Cyclone V GX series produced by Intel (formerly known as Altera). This chip has the following characteristics and parameters:
  • Multilayer precision PCB

    Multilayer precision PCB

    Multilayer precision PCB--The manufacturing method of multilayer board is generally made by the inner layer pattern first, and then the single or double-sided substrate is made by printing and etching method, which is included in the specified interlayer, and then heated, pressurized and bonded. As for the subsequent drilling, it is the same as the plating through-hole method of double-sided board.
  • XC7Z030-2FFG676I

    XC7Z030-2FFG676I

    XC7Z030-2FFG676I is a type of FPGA (Field Programmable Gate Array) made by Xilinx. This specific FPGA has 154,580 Logic Cells, operates at a speed of up to 1 GHz, and features 4 Transceivers,
  • 10AX115N3F40I2LG

    10AX115N3F40I2LG

    10AX115N3F40I2LG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCF01SVOG20C

    XCF01SVOG20C

    XCF01SVOG20C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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