XC3S100E-4VQG100I Manufacturers

We thinks what prospects think, the urgency of urgency to act from the interests of a client position of theory, allowing for greater high-quality, reduced processing costs, rates are much more reasonable, won the new and previous consumers the support and affirmation for XC3S100E-4VQG100I, The continual availability of substantial grade goods in combination with our exceptional pre- and after-sales support ensures strong competitiveness in an increasingly globalized marketplace.
XC3S100E-4VQG100I, To create more creative goods, maintain high-quality goods and update not only our merchandise but ourselves so as to keep us ahead of the world, and the last but most vital one: to make every client satisfied with everything we provide and to grow stronger together. To be the real winner, starts here!

Hot Products

  • BCM88795CB0KFSBG

    BCM88795CB0KFSBG

    BCM88795CB0KFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • HI-15530PSI

    HI-15530PSI

    HI-15530PSI is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7VX690T-2FFG1927C

    XC7VX690T-2FFG1927C

    XC7VX690T-2FFG1927C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 4-Layer Rigid-Flex PCB

    4-Layer Rigid-Flex PCB

    4-Layer Rigid-Flex PCB In terms of equipment, due to the difference in material characteristics and product specifications, the equipment in the lamination and copper plating parts must be corrected. The applicability of the equipment will affect the yield and stability of the product, so it will enter the Rigid-Flex Before the production of the board, the suitability of the equipment must be considered. The following is about 4 Layer Rigid Flex PCB related, I hope to help you better understand 4 Layer Rigid Flex PCB.
  • Buried Copper Coin PCB

    Buried Copper Coin PCB

    The so-called Buried Copper Coin PCB is a PCB board in which a copper Coin is partially embedded on the PCB. The heating elements are directly attached to the surface of the copper Coin board, and the heat is transferred out through the copper Coin.
  • XCVU190-3FLGB2104E

    XCVU190-3FLGB2104E

    ​XCVU190-3FLGB2104E is an FPGA (Field Programmable Gate Array) chip launched by Xilinx, which demonstrates strong application potential in multiple fields due to its high programmability, high computing performance, and low power consumption characteristics. This chip has a wide range of applications, including but not limited to

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