Products
Home > Products > XC2C64A-7CPG56I

XC2C64A-7CPG56I Manufacturers

Sticking to the perception of "Creating products of top of the range and earning mates with people today from all over the world", we constantly put the desire of consumers in the first place for XC2C64A-7CPG56I, We sincerely welcome mates to negotiate organization and start cooperation. We hope to affix hands with good friends in different industries to produce a fantastic long term.
XC2C64A-7CPG56I, By continuous innovation, we will supply you with more valuable merchandise and services, and also make a contribution for the development of the automobile industry at home and abroad. Both domestic and foreign merchants are strongly welcomed to join us to grow together.

Related Products

Hot Products

  • EP2SGX130GF1508C3N

    EP2SGX130GF1508C3N

    EP2SGX130GF1508C3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 8MM Thick Megtron4 PCB

    8MM Thick Megtron4 PCB

    The success of a product depends on its internal quality. Second, it takes into account the overall beauty. Both are perfect to be considered successful. On a PCB board, the layout of the components needs to be balanced, dense and orderly, not top-heavy or heavy. The following is about 36 Layer 8MM Thick Megtron4 PCB related, I hope to help you better understand 36 Layer 8MM Thick Megtron4 PCB.
  • EP1S20F484C6

    EP1S20F484C6

    EP1S20F484C6 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP1K30QC208-3N

    EP1K30QC208-3N

    EP1K30QC208-3N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP2C50F672I8N

    EP2C50F672I8N

    EP2C50F672I8N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7A35T-2FGG484I

    XC7A35T-2FGG484I

    XC7A35T-2FGG484I is a type of FPGA (Field Programmable Gate Array) made by Xilinx. This specific FPGA has 33,280 Logic Cells, operates at a speed of up to 667 MHz, and features 1 Transceiver, 1 Mb of Block RAM, and 90 DSP Slices.
  • Related Blog
  • Reviews

  • How to fix the integrated circuit problem

    The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.

  • Semiconductor parts have risen with the wind

    Every time through AI flash, Guojin Securities said that semiconductor equipment parts play an important role in the industrial chain, with a large number, a wide variety and obvious market fragmentation characteristics

  • DHI board surface treatment technology carbon series direct plating

    This article will review the development history of carbon series direct plating technology, including new breakthroughs in equipment technology, and how to apply it to today's flagship mobile phones with extremely fine line width and line spacing.

  • Processing of FPC soft plate and reinforcing plate

    FPC soft board reinforced board processing, FPC soft board reinforced board is unique to flexible circuit board, and its shape and materials are also diverse

  • Change of substrate size in PCB manufacturing process

    the difference between longitude and latitude causes the change of substrate size; Due to the failure to pay attention to the fiber direction during shearing, the shear stress remains in the substrate.

  • PCB proofing layout setting skills

    PCB proofing, as a component of high-precision electronic products, has been a very common existence in life. However, we all know that domestic professional PCB proofing design needs different point settings in different stages, and large grid points will be used for device layout in the layout stage. Let's take a look at the detailed PCB proofing layout setting skills.

Send Inquiry