XC2C64A-7CP56I Manufacturers

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Hot Products

  • 5CEBA9F23C7N

    5CEBA9F23C7N

    ​5CEBA9F23C7N is a Cyclone V series FPGA chip produced by Intel (formerly Altera). This chip has high performance and flexibility, suitable for various complex design requirements. Its main features include:
  • Al2O3 PCB

    Al2O3 PCB

    Al2O3 PCB has excellent corrosion resistance, and has high thermal conductivity, excellent chemical stability and thermal stability, and other properties that organic substrates do not have. Aluminum Nitride Ceramic base board an ideal packaging material for a new generation of large-scale integrated circuits and power electronic modules. The following is about Al2O3 PCB I hope to help you better understand Al2O3 PCB.
  • 10 Layer 4Step HDI PCB

    10 Layer 4Step HDI PCB

    HDI is the English abbreviation of High Density Interconnector, high-density interconnect (HDI) manufacturing printed circuit board. The printed circuit board is a structural element formed by insulating material supplemented by conductor wiring. The following is about 10 Layer 4Step HDI PCB related, I hope to help you better understand 10 Layer 4Step HDI PCB.
  • XC7VX690T-2FF1157I

    XC7VX690T-2FF1157I

    XC7VX690T-2FF1157I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM56340A0KFSBLG

    BCM56340A0KFSBLG

    BCM56340A0KFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU37P-2FSVH2894E

    XCVU37P-2FSVH2894E

    XCVU37P-2FSVH2894E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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