XC17S40XLPDG8C Manufacturers

we can easily provide top quality solutions, competitive value and best client company. Our destination is "You come here with difficulty and we provide you a smile to take away" for XC17S40XLPDG8C, Our ultimate objective is always to rank as a top brand also to lead as a pioneer inside our field. We're sure our prosperous experience in tool generation will gain customer's trust, Wish to co-operate and co-create an even better upcoming with you!
XC17S40XLPDG8C, To create more creative products and solutions, maintain high-quality goods and update not only our products and solutions but ourselves so as to keep us ahead of the world, and the last but most vital one: to make every client satisfied with everything we present and to grow stronger together. To be the real winner, starts here!

Hot Products

  • 5CGXFC5C6F23I7N

    5CGXFC5C6F23I7N

    ​5CGXFC5C6F23I7N The Cyclone ® V GX device can simultaneously meet the continuously decreasing requirements of power consumption, cost, and time to market, as well as the increasing bandwidth requirements for large-scale and cost sensitive applications
  • 10AX048H3F34I2SG

    10AX048H3F34I2SG

    ​10AX048H3F34I2SG Hongtai Quick Electronics is 100% in stock with a complete range of products. We only offer original products with a 15 year reputation, providing a safe and reliable electronic component procurement platform
  • HDI PCB

    HDI PCB

    HDI PCB is the abbreviation of "high density interconnector", which is a kind of printed circuit board (PCB) production. It is a kind of circuit board with high line distribution density using micro blind buried hole technology.
  • XCVU13P-2FHGB2104E

    XCVU13P-2FHGB2104E

    XCVU13P-2FHGB2104E is a high-end field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 1.3 million logic cells, 50 Mb of block RAM, and 624 Digital Signal Processing (DSP) slices, making it ideal for high-performance applications such as high-performance computing, machine vision, and video processing. It operates on a 0.85V to 0.9V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 1 GHz. The device comes in a flip-chip BGA (FHGB2104E) package with 2104 pins, providing high pin-count connectivity for a variety of applications. XCVU13P-2FHGB2104E is commonly used in advanced systems such as wireless communications, cloud computing, and high-speed networking. The device is known for its high processing capacity, low power consumption, and high-speed performance, making it a top choice for mission-critical applications where reliability and performance are critical.
  • XCVU9P-L2FSGD2104I

    XCVU9P-L2FSGD2104I

    XCVU9P-L2FSGD2104I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU17EG-2FFVB1517I

    XCZU17EG-2FFVB1517I

    XCZU17EG-2FFVB1517I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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