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XAZU11EG-1FFVF1517Q Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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  • built-in Copper Coin PCB

    built-in Copper Coin PCB

    built-in Copper Coin PCB-- HONTEC uses prefabricated copper blocks to splice with FR4, then uses resin to fill and fix them, and then combines them perfectly by copper plating to connect them with the circuit copper
  • 5AGXMA7G4F31C5G

    5AGXMA7G4F31C5G

    ​5AGXMA7G4F31C5G is a field programmable gate array (FPGA) with the following features: In addition, the product also has distributed RAM and embedded block RAM, with specific capacities of 15108 kbit and 1448 kbit, respectively. These features make 5AGXMA7G4F31C5G suitable for application scenarios that require high performance and high integration
  • XC7V585T-2FFG1761C

    XC7V585T-2FFG1761C

    XC7V585T-2FFG1761C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCZU11EG-2FFVC1760E

    XCZU11EG-2FFVC1760E

    XCZU11EG-2FFVC1760E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 6 layers ELIC HDI PCB

    6 layers ELIC HDI PCB

    Any Layer Inner Via Hole,The arbitrary interconnection between layers can meet the wiring connection requirements of high-density HDI boards. Through the setting of thermally conductive silicone sheets, the circuit board has good heat dissipation and shock resistance.The following is about 6 layers ELIC HDI PCB, I hope to help you better understand 6 layers ELIC HDI PCB.
  • 8-layer FR408HR PCB

    8-layer FR408HR PCB

    8-layer FR408HR PCB substrate is suitable for: special substrate for communication and big data industries.The following is about 8 layer FR408HR, I hope to help you better understand 8 layer FR408HR.
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