Products
Home > Products > XA3S1200E-4FTG256Q

XA3S1200E-4FTG256Q Manufacturers

With this motto in mind, we've turn into one of quite possibly the most technologically innovative, cost-efficient, and price-competitive manufacturers for XA3S1200E-4FTG256Q, We have been sincerely wanting forward to cooperate with consumers all over the earth. We feel we can easily satisfy with you. We also warmly welcome buyers to visit our manufacturing unit and purchase our products and solutions.
XA3S1200E-4FTG256Q, We strive for excellence, constant improvement and innovation, is committed to make us the "customer trust" and the "first choice of engineering machinery accessories brand" suppliers. Choose us, sharing a win-win situation!

Related Products

Hot Products

  • 100G optoelectronic PCB

    100G optoelectronic PCB

    100G optoelectronic PCB is a packaging substrate for a new generation of high computing, which integrates light with electricity, transmits signals with light and operates with electricity. It adds a layer of light guide to the traditional printed circuit board, which is very mature at present.
  • XC6SLX100-2FGG900C

    XC6SLX100-2FGG900C

    XC6SLX100-2FGG900C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7A35T-L2CSG325E

    XC7A35T-L2CSG325E

    XC7A35T-L2CSG325E is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCVU125-2FLVB2104I

    XCVU125-2FLVB2104I

    ​XCVU125-2FLVB2104I is a high-performance FPGA chip launched by Xilinx, belonging to the VERSAL series. This chip is manufactured using advanced technology, with a large number of logic components and adaptive logic modules, as well as abundant embedded memory resources
  • EP2C50F672C8N

    EP2C50F672C8N

    EP2C50F672C8N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCV100E-6FG256C

    XCV100E-6FG256C

    XCV100E-6FG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Related Blog
  • Reviews

  • What are the advantages of using multilayer pcb boards?

    Multi-layer PCBs can meet the needs of lightweight and miniaturized electronic equipment, reduce the connection between components, and are simple to install and highly reliable.

  • Introduction to semiconductor

    Germanium, silicon, selenium, gallium arsenide and many metal oxides, metal sulfides and other objects, whose conductivity is between conductor and insulator, are called semiconductors. Semiconductors have some special properties. For example, the thermistor (thermistor) for automatic control can be made by using the relationship between the resistivity and temperature of the semiconductor; Using its photosensitive characteristics, photosensitive elements for automatic control can be made, such as photocells, photocells and photoresistors

  • Change of substrate size in PCB manufacturing process

    the difference between longitude and latitude causes the change of substrate size; Due to the failure to pay attention to the fiber direction during shearing, the shear stress remains in the substrate.

  • Development status of my country's integrated circuit industry

    28-nanometer growth, 14-nanometer successful debut, 7-nanometer research and development...From 28-nanometer to 7-nanometer, the distance between my country's integrated circuit industry and the international advanced level is getting smaller and smaller.

  • The growth rate of global chip market slowed down in the first quarter of 2022

    Our reporter Shen Cong reported: the American Semiconductor Industry Association (SIA) recently released the data of the global chip market in the first quarter of 2022. The data show that the growth rate of the global chip market has slowed down significantly

  • PCB production, you must pay attention to these matters!

    Cutting, fillet, edge grinding, baking, inner pretreatment, coating, exposure, DES (development, etching, film removal), punching, AOI inspection, VRS repair, browning, lamination, pressing, drilling target, gong edge, drilling, copper plating, film pressing, printing, text, surface treatment, final inspection, packaging, and other processes are extremely numerous. It sounds great, but the process is so long, and there are many problems to pay attention to.

Send Inquiry