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XA3S1200E-4FGG400I Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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    HI-8448PCTF-10

    he HI-8448PCTF-10 is an octal ARINC 429 line receiver IC designed for use in demanding aviation electronics applications. It features eight independent receiver channels that convert incoming ARINC 429 data bus signals into a pair of complementary Metal-Oxide-Semiconductor (CMOS)/Transistor-Transistor Logic (TTL) outputs.
  • XCKU025-2FFVA1156E

    XCKU025-2FFVA1156E

    ​The XCKU025-2FFVA1156E has a power option that achieves the best balance between required system performance and low power envelope. Kintex UltraScale+devices are an ideal choice for packet processing and DSP intensive functions, as well as various applications ranging from wireless MIMO technology to Nx100G networks and data centers.
  • N4000-13 PCB

    N4000-13 PCB

    N4000-13 PCB is a kind of High Performance PCB produced by nelco in Singapore. Its main application fields are aviation and communication industry. It has high temperature resistance, low temperature resistance, good water absorption and strong stability
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    8-layer gold finger PCB

    The 8-layer gold finger PCB is actually coated with a layer of gold on the copper clad laminate by a special process, because the gold has strong oxidation resistance and strong conductivity.
  • Medical Equipment HDI PCB

    Medical Equipment HDI PCB

    HDI imaging, while achieving low defect rate and high output, can achieve stable production of HDI conventional high-precision operation. For example: advanced mobile phone board, CSP pitch is less than 0.5mm. The board structure is 3 + n + 3, there are three superposed vias on each side, and 6 to 8 layers of coreless printed boards with superimposed vias.The following is about Medical Equipment HDI PCB related, I hope to help you better understand Medical Equipment HDI PCB.
  • XC7K160T-3FFG676E

    XC7K160T-3FFG676E

    XC7K160T-3FFG676E is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
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