XA3S1200E-4FGG400I Manufacturers

High quality Initial,and Buyer Supreme is our guideline to offer the ideal assistance to our shoppers.At present, we are striving our best to become amongst the ideal exporters inside our industry to satisfy shoppers more want for XA3S1200E-4FGG400I, We have been prepared to offer you the top suggestions on the designs of one's orders in a professional way if you need. During the meantime, we retain on developing new technologies and building new designs so as for making you ahead within the line of this business.
XA3S1200E-4FGG400I, We attained ISO9001 which provides solid foundation for our further development. Persisting in "High quality, Prompt Delivery, Competitive Price", now we have established long-term cooperation with clients from both overseas and domestically and get new and old clients' high comments. It is our great honor to meet your demands. We have been sincerely expecting your attention.

Hot Products

  • EP1S30F780I6N

    EP1S30F780I6N

    EP1S30F780I6N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 6-layers 2Step HDI PCB

    6-layers 2Step HDI PCB

    6-layers 2Step HDI PCB Laminate twice. Take an eight-layer circuit board with blind/buried vias as an example. First, laminate layers 2-7, first make elaborate blind/buried vias, and then laminate layer 1 and 8 layers to make well-made vias .The following is about6 layers 2Step HDI, I hope to help you better understand 6 layers 2Step HDI.
  • XC7S75-1FGGA676I

    XC7S75-1FGGA676I

    ​XC7S75-1FGGA676I is a Xilinx chip belonging to the Spartan-7 series, manufactured using 28 nanometer technology. It is a field programmable logic array (FPGA) chip with various excellent features. XC7S75-1FGGA676I is equipped with MicroBlaze ™ A soft processor that can achieve performance of over 200 DMIPs and support DDR3 at 800Mb/s.
  • XC3S200AN-5FTG256C

    XC3S200AN-5FTG256C

    XC3S200AN-5FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC4VFX100-10FF1152C

    XC4VFX100-10FF1152C

    XC4VFX100-10FF1152C is a high-performance field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 101,261 logic cells, 2.8 Mb of distributed RAM, and 36 Digital Signal Processing (DSP) blocks, making it suitable for a wide range of applications. It operates on a 1.0V to 1.2V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCI Express
  • ADG1434YRUZ

    ADG1434YRUZ

    ADG1434YRUZ is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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