S29GL01GS11TFIV20 Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • XA6SLX16-3CSG324I

    XA6SLX16-3CSG324I

    XA6SLX16-3CSG324I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7A35T-2CSG325I

    XC7A35T-2CSG325I

    XC7A35T-2CSG325I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC5VSX50T-3FFG665C

    XC5VSX50T-3FFG665C

    XC5VSX50T-3FFG665C is an advanced field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 49,920 logic cells, 2.7 Mb of distributed RAM, and 400 Digital Signal Processing (DSP) slices, making it suitable for a wide range of high-performance applications. It operates on a 1.0V to 1.2V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCI Express. The -3 speed grade of this FPGA allows it to operate up to 500 MHz. The device comes in a flip-chip fine-pitch ball grid array (FFG665C) package with 665 pins, providing high pin-count connectivity for a variety of applications. XC5VSX50T-3FFG665C is commonly used in industrial automation, aerospace and defense, telecom, and high-performance computing applications. The device is known for its high processing capacity, low power consumption, and high-speed performance, making it an excellent choice for mission-critical and high-reliability applications.
  • LTM4668IY#PBF

    LTM4668IY#PBF

    LTM4668IY#PBF is an electronic component, packaged in BGA-49 and produced by LINEAR/Lingte. The batch inventory information of this component shows that it is widely used in different electronic devices. Specifically, LTM4668IY # PBF belongs to µ Module ® The series
  • XC7A200T-L2FFG1156E

    XC7A200T-L2FFG1156E

    XC7A200T-L2FFG1156E is an Artix-7 series FPGA chip produced by Xilinx. The chip is based on a 28 nanometer high-performance low-power (HPL) process, providing 215360 logic units and 500 I/O ports, supporting data rates up to 6.6Gb/s, and built-in 16 high-speed transceivers.
  • XC7A200T-1SBG484I

    XC7A200T-1SBG484I

    ​XC7A200T-1SBG484I is a high-performance, step-down DC-DC power module developed by Analog Devices, a leading semiconductor technology company. This device features a wide input voltage range of 6V to 36V and a maximum output current of 5A.

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