NB3N5573DTG Manufacturers

"Sincerity, Innovation, Rigorousness, and Efficiency" is the persistent conception of our company for the long-term to develop together with customers for mutual reciprocity and mutual benefit for NB3N5573DTG, In a word, when you choose us, you choose a ideal existence. Welcome to visit our factory and welcome your get! For even further inquiries, remember to usually do not hesitate to make contact with us.
NB3N5573DTG, Our continual availability of high grade products in combination with our excellent pre-sale and after-sales service ensures strong competitiveness in an increasingly globalized market. welcome new and old customers from all walks of life to contact us for future business relationships and mutual success!

Hot Products

  • Microstrip PCB

    Microstrip PCB

    Microstrip PCB refers to high-frequency PCB. For special circuit board with high electromagnetic frequency, generally speaking, high frequency board can be defined as frequency above 1GHz. The high frequency board comprises a core plate with a hollow groove and a copper clad plate bonded to the upper surface and the lower surface of the core board through flow glue. The edges of the upper opening and the lower opening of the hollow groove are provided with ribs.
  • AD7228ACRZ

    AD7228ACRZ

    AD7228ACRZ Digital-to-Analog Converter (DAC) ADI/Analog DAC-DAC OCTAL 8-BIT 5-15V DAC IC
  • XC6SLX100-3FGG900I

    XC6SLX100-3FGG900I

    XC6SLX100-3FGG900I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX25-2FTG256C

    XC6SLX25-2FTG256C

    XC6SLX25-2FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU080-2FFVB1760E

    XCVU080-2FFVB1760E

    ​XCVU080-2FFVB1760E is an FPGA (Field Programmable Gate Array) product produced by Xilinx, belonging to the Kintex UltraScale series. This FPGA has the following features and specifications:
  • EP2SGX130GF1508C3N

    EP2SGX130GF1508C3N

    EP2SGX130GF1508C3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

Send Inquiry